Chinabest Home Appliance WBR1-IPEX Wireless Module User Manual

1 Features

 Embedded low-

power KM4 MCU, which can also function as an application processor



Clock rate: 100 MHz



Working voltage: 3.0 V to 3.6 V



Peripherals: seven GPIOs and two universal asynchronous

(UARTs)

 Wi-Fi /BT connectivity

 802.11b/g/n20



Channels 1 to 14 at 2.4 GHz



Compatible with Bluetooth low energy (BLE) 4.2

power)



WPA and WPA2 security modes

 Up to +20 dBm

EIPR



Smart network configuration for Android and iOS devices

 FPC IPEX

antenna



Certified by CE, FCC, and SRRC



Working temperature:

1.2 Applications

 Intelligent building



Smart household and home appliances

 Smart socket and light

 Industrial wireless

control

 Baby monitor

 Network camera

 Intelligent bus

WBR1

1

power KM4 MCU, which can also function as an application processor

Clock rate: 100 MHz

Working voltage: 3.0 V to 3.6 V

Peripherals: seven GPIOs and two universal asynchronous

receivers/transmitters

Channels 1 to 14 at 2.4 GHz

Compatible with Bluetooth low energy (BLE) 4.2

(Up to +9dBm

EIPR

WPA and WPA2 security modes

EIPR

output power in 802.11b mode

Smart network configuration for Android and iOS devices

antenna

Certified by CE, FCC, and SRRC

Working temperature:

–20°C to +85°C

Smart household and home appliances

control

WBR1

-IPEX Datasheet

power KM4 MCU, which can also function as an application processor

receivers/transmitters

EIPR

output

1 Feature

2 Module Interfaces

................................

2.1 Dimensions and Footprint

2.2 Interface Pin Definition

3 Electrical Parameters

................................

3.1 Absolute Electrical Parameters

3.2 Electrical Conditions

3.3 RF Current Consumption

3.4 Working Current

................................

4 RF Features

................................

4.1 Basic RF Featu

res

4.2 TX Performance

................................

4.3 RX Performance

................................

5 Antenna Information

................................

5.1 Antenna Type

................................

5.2 Antenna Interference Reduction

6 Packaging Information and Production Instructions

6.1 Mechanical Dimensions

6.2 Recommended PCB Layout

6.3 Production Instructions

6.4 Recommended Oven Temperature Curve

6.5 Storage Conditions

7 MOQ and Packing Information

WBR1

2

Contents

................................

2.1 Dimensions and Footprint

................................

2.2 Interface Pin Definition

................................................................

...........................

................................

3.1 Absolute Electrical Parameters

................................

3.2 Electrical Conditions

................................................................

...............................

3.3 RF Current Consumption

................................

res

................................................................

................................

5.2 Antenna Interference Reduction

................................

6 Packaging Information and Production Instructions

................................

.......................

6.1 Mechanical Dimensions

................................................................

.......................

6.2 Recommended PCB Layout

................................

6.3 Production Instructions

................................................................

.........................

6.4 Recommended Oven Temperature Curve

................................

...........................

6.5 Storage Conditions

................................................................

...............................

7 MOQ and Packing Information

................................................................

.......................

WBR1

-IPEX Datasheet

............ 1

................................

............. 4

................................

...................... 4

...........................

4

................................

........ 6

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.............. 6

...............................

6

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....................... 7

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..... 7

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......9

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........ 10

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........ 10

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........... 10

.......................

10

.......................

10

................................

................. 12

.........................

13

...........................

15

...............................

16

.......................

17

................................

................

...................... 8

...............................

8

..... 9

Table 2-1 WBR1-IPEX

interface pins

Table 3-

1 Absolute electrical parameters

Table 3-

2 Normal electrical conditions

Table 3-

3 Power consumption during constant transmission

Table 3-

4 Power consumption during constant receiving

Table 3-5 WBR1-IPEX

working current

Table 4-

1 Basic RF features

Table 4-

2 Performance during constant transmission

Table 4-3 RX sensitivity

................................

Figure 2-1 WBR1-IPEX

front and rear views

Figure 6-1 WBR1-IPEX

mechanical dimensions

Figure 6-2 Side view

................................

Figure 6-3 WBR1-IPEX

pins

Figure 6-

4 Layout of the PCB to which

Figure 6-5 HIC for WBR1-

IPEX

Figure 6-

6 Oven temperature curve

WBR1

3

Tables

interface pins

................................

1 Absolute electrical parameters

................................

2 Normal electrical conditions

................................

3 Power consumption during constant transmission

................................

4 Power consumption during constant receiving

................................

working current

................................

1 Basic RF features

................................................................

..............................

2 Performance during constant transmission

................................

.......................

................................

Figures

front and rear views

................................

mechanical dimensions

................................

...............................

................................

pins

................................................................

..............................

4 Layout of the PCB to which

WBR1-IPEX applies

................................

IPEX

................................................................

.........................

6 Oven temperature curve

................................

WBR1

-IPEX Datasheet

................................

................... 6

................................

............ 8

................................

................. 8

................................

.............. 9

................................

.................... 9

................................

............... 9

..............................

10

.......................

11

................................

..... 11

................................

....... 6

...............................

13

................................

.......... 13

..............................

14

................................

............ 15

.........................

16

................................

.................. 17

2 Module Interfaces

2.1 Dimensions and Footprint

WBR1-IPEX

has two rows of 1

The WBR1-IPEX

dimensions (H x W x D) are 2.9±0.15 mm x 18±0.35 mm x 23.5±0.35

mm. Figure 2-1 shows the

WBR1

Figure 2

2.2 Interface Pin Definition

Table 2

Pin No. Symbol

1 Vin

P

2 TX

I/O

3 RX

I/O

WBR1

4

2 Module Interfaces

2.1 Dimensions and Footprint

has two rows of 1

8 pins (2 x 9) with a 1.5 mm pin spacing.

dimensions (H x W x D) are 2.9±0.15 mm x 18±0.35 mm x 23.5±0.35

WBR1

-IPEX front and rear views.

Figure 2

-1 WBR1-IPEX front and rear views

2.2 Interface Pin Definition

Table 2

-1 WBR1-IPEX interface pins

I/O Type Function

P

UART_TX power conversion pin (5 V or 3.3 V)

I/O

GPIOA_14, UART_TX (user-

side serial

interface)

I/O

GPIOA_13, UART_RX (user-

side serial

interface)

WBR1

-IPEX Datasheet

dimensions (H x W x D) are 2.9±0.15 mm x 18±0.35 mm x 23.5±0.35

UART_TX power conversion pin (5 V or 3.3 V)

side serial

Pin No. Symbol

4 3V3

P

5 GND

P

6 A_2

I/O

7 A_3

I/O

8 Log_TX

P

9 A_4

I/O

10 A_11

I/O

11 Log_RX

I/O

12 A_12

I/O

13 A_17

I/O

14 GND

P

15 GND

P

16 EN

I/O

17 A_18

I/O

18 GND

P

Note:

P

indicates power supply pins, and

WBR1

5

I/O Type Function

P

Power supply pin (3.3 V)

P

Power supply reference ground pin

I/O

GPIOA_2, hardware PWM pin, which is

connected to pin 18 on the internal IC

I/O

GPIOA_3, hardware PWM pin, which is

connected to pin 19 on the internal IC

P

GPIOA_16, UART_Log_TXD, which is used

for printing the module internal

information

and can be configured as a common GPIO

I/O

GPIOA_4, hardware PWM pin, which is

connected to pin 20 on the internal IC

I/O

GPIOA_11, hardware PWM pin, which is

connected to pin 25 on the internal IC

I/O

GPIOA_15,

UART_Log_RXD, which is used

for printing the module internal information

and can be configured as a common GPIO

I/O

GPIOA_12, hardware PWM pin, which is

connected to pin 26 on the internal IC

I/O

GPIOA_17, hardware PWM pin, which is

conne

cted to pin 38 on the internal IC

P

Power supply reference ground pin

P

Power supply reference ground pin

I/O

Enable pin, which is active at a high level (The

pin has been pulled up and is externally

controllable.)

I/O

GPIOA_18, hardware PWM pin, which is

connected to pin 39 on the internal IC

P

Power supply reference ground pin

indicates power supply pins, and

I/O indicates input/output pins.

WBR1

-IPEX Datasheet

Power supply reference ground pin

GPIOA_2, hardware PWM pin, which is

connected to pin 18 on the internal IC

GPIOA_3, hardware PWM pin, which is

connected to pin 19 on the internal IC

GPIOA_16, UART_Log_TXD, which is used

information

and can be configured as a common GPIO

GPIOA_4, hardware PWM pin, which is

connected to pin 20 on the internal IC

GPIOA_11, hardware PWM pin, which is

connected to pin 25 on the internal IC

UART_Log_RXD, which is used

for printing the module internal information

and can be configured as a common GPIO

GPIOA_12, hardware PWM pin, which is

connected to pin 26 on the internal IC

GPIOA_17, hardware PWM pin, which is

cted to pin 38 on the internal IC

Power supply reference ground pin

Enable pin, which is active at a high level (The

pin has been pulled up and is externally

GPIOA_18, hardware PWM pin, which is

connected to pin 39 on the internal IC

Power supply reference ground pin

3 Electrical Parameters

3.1 Absolute

Electrical Parameters

Table 3

Parameter

Ts

VDD

Static electricity voltage

(human body model)

Static electricity voltage

(machine model)

3.2 Electrical Conditions

Table 3

Parameter

Description

Ta

Working temperature

VDD Working

voltage

VIL I/O low-

level input

VIH I/O high-

level input

VOL I/O low-

level output

VOH I/O high-

level output

Imax

I/O drive current

Cpad

Input pin capacitance

WBR1

6

3 Electrical Parameters

Electrical Parameters

Table 3

-1 Absolute electrical parameters

Description Minimum

Value

Maximum

Value

Storage temperature –40

105

Power supply voltage –0.3

3.6

Tamb = 25°C N/A 2

Tamb = 25°C N/A

0.5

3.2 Electrical Conditions

Table 3

-2 Normal electrical conditions

Description

Minimum

Value

Typical

Value

Maximum

Value

Working temperature

–20 N/A 85

voltage

3.0 N/A 3.6

level input

N/A N/A 0.8

level input

2.0 N/A N/A

level output

N/A N/A 0.4

level output

2.4 N/A N/A

I/O drive current

N/A N/A 16

Input pin capacitance

N/A 2 N/A

WBR1

-IPEX Datasheet

Maximum

Value

Unit

105

°C

3.6

V

kV

0.5

kV

Maximum

Value

Unit

°C

V

mA

pF

3.3 RF Current Consumption

Table 3-

3 Power consumption during constant transmission

Symbol

Mode

IRF

802.11b

11 Mbit/s

IRF

802.11g

54 Mbit/s

IRF

802.11n BW20

MCS7

IRF

Table 3-

4 Power consumption during constant receiving

Symbol

IRF

3.4 Working Current

Table 3

Working Mode

EZ

The module is in EZ mode, and the

Wi-

Fi indicator blinks quickly.

WBR1

7

3.3 RF Current Consumption

3 Power consumption during constant transmission

Mode

Power

Typical

Value

Peak

Value

11 Mbit/s

17 dBm 217 268

18 dBm 231 283

54 Mbit/s

15 dBm 159 188

17.5 dBm 177 213

802.11n BW20

13 dBm 145 167

16.5 dBm 165 193

4 Power consumption during constant receiving

Mode Typical

Value

Peak

Value

802.11b

11 Mbit/s

63 65

802.11g

54 Mbit/s

65 67

802.11n

HT20 MCS7

65 67

3.4 Working Current

Table 3

-5 WBR1-IPEX working current

Working Status (Ta = 25°C) Typical

Value

The module is in EZ mode, and the

Fi indicator blinks quickly.

75

WBR1

-IPEX Datasheet

3 Power consumption during constant transmission

Unit

mA

4 Power consumption during constant receiving

Unit

mA

Typical

Peak

Value

Unit

324 mA

Working Mode

Connected and idle

The module is connected to the

network, and the Wi

steady on.

Connected and

operating

The module is connected to the

network, and the Wi

steady on.

Disconnected

The module is disconnected from the

netwo

steady off.

4 RF Features

4.1 Basic RF Features

Parameter

Frequency range

Wi-Fi standard

BLE standard

Data transmission rate

Antenna type

WBR1

8

Working Status (Ta = 25°C) Typical

Value

The module is connected to the

network, and the Wi

-Fi indicator is

steady on.

64

The module is connected to the

network, and the Wi

-Fi indicator is

steady on.

66

The module is disconnected from the

netwo

rk, and the Wi-Fi indicator is

steady off.

66

4.1 Basic RF Features

Table 4-1 Basic RF features

Description

Bluetooth:2402-2480MHz

Wi-Fi:2412-2462MHz

IEEE 802.11b/g/n (channels 1 to 14

,Ch1

US/CA,Ch1-13 for EU/CN)

Bluetooth 4.2

Data transmission rate

802.11b: 1, 2, 5.5, or 11 (Mbit/s)

802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)

802.11n: HT20 MCS0 to MCS7

FPC IPEX Antenna，-4.84dBi Gain

WBR1

-IPEX Datasheet

Typical

Peak

Value

Unit

314 mA

305 mA

309 mA

,Ch1

-11 for

802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)

4.2 TX Performance

Table 4-

2 Performance during constant transmission

Parameter

Average RF output power,

802.11b CCK mode

Average RF output power,

802.11g OFDM mode

Average RF output power,

802.11n OFDM mode

Average RF output power,

BLE 4.2 1M

Frequency error

EVM under 802.11b CCK, 11 Mbit/s, 17.5

dBm

EVM under 802.11g OFDM, 54 Mbit/s,

dBm

EVM under 802.11n OFDM, MCS7, 13.5

dBm

4.3 RX Performance

Parameter

PER < 8%, 802.11b CCK

mode

PER < 10%, 802.11g OFDM

mode

PER < 10%, 802.11n OFDM

mode

WBR1

9

4.2 TX Performance

2 Performance during constant transmission

Parameter

Minimum

Value

Typical

Value

Maximum

Average RF output power,

1 Mbit/s N/A 17.5

N/A

Average RF output power,

54 Mbit/s N/A 14.5

N/A

Average RF output power,

MCS7 N/A 13.5

N/A

Average RF output power,

6.5

–20 N/A

+20

EVM under 802.11b CCK, 11 Mbit/s, 17.5

–

EVM under 802.11g OFDM, 54 Mbit/s,

14.5 –

EVM under 802.11n OFDM, MCS7, 13.5

–

4.3 RX Performance

Table 4-3 RX sensitivity

Parameter

Minimum

Value

Typical

Value

Maximum

1 Mbit/s N/A –91

N/A

PER < 10%, 802.11g OFDM

54 Mbit/s N/A –75

N/A

PER < 10%, 802.11n OFDM

MCS7 N/A –72

N/A

WBR1

-IPEX Datasheet

Maximum

Value

Unit

N/A

dBm

N/A

dBm

N/A

dBm

+20

ppm

10 dB

29 dB

30 dB

Maximum

Value

Unit

N/A

dBm

N/A

dBm

N/A

dBm

PER < 10%,

BLE 4.2 mode

5 Antenna Information

5.1 Antenna Type

WBR1-IPEX uses a FPC

IPEX

5.2 Antenna Interference Reduction

To ensure optimal Wi-

Fi performance when the Wi

antenna, it is recommended that the antenna be at least 15 mm away from other metal

parts.

6 Packaging Information and Production Instructions

6.1 Mechanical Dimensions

The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm. Figure

6-1 shows the WBR1-

IPEX

WBR1

10

BLE 4.2 mode

1M N/A -93

N/A

5 Antenna Information

IPEX

antenna with a gain of -4.84 dBi.

5.2 Antenna Interference Reduction

Fi performance when the Wi

-

Fi module uses an onboard PCB

antenna, it is recommended that the antenna be at least 15 mm away from other metal

6 Packaging Information and Production Instructions

6.1 Mechanical Dimensions

The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm. Figure

IPEX

mechanical dimensions.

WBR1

-IPEX Datasheet

N/A

dBm

Fi module uses an onboard PCB

antenna, it is recommended that the antenna be at least 15 mm away from other metal

6 Packaging Information and Production Instructions

The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm. Figure

Figure 6

Note:

The default dimensional tolerance is ±0.35 mm. If

clearly specify them in the datasheet after communication.

WBR1

11

Figure 6

-1 WBR1-IPEX mechanical dimensions

Figure 6-2 Side view

The default dimensional tolerance is ±0.35 mm. If

a customer has other requirements,

clearly specify them in the datasheet after communication.

WBR1

-IPEX Datasheet

a customer has other requirements,

6.2 Recommended PCB Layout

WBR1

12

6.2 Recommended PCB Layout

Figure 6-3 WBR1-IPEX pins

WBR1

-IPEX Datasheet

Figure 6-

4 Layout of the PCB to which

6.3 Production Instructions

1.

(1)

SMT placement equipment

i.

Reflow soldering machine

ii.

Automated optical inspection (AOI) equipment

iii.

Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment

i. Cabinet oven

ii. Anti-

static heat

WBR1

13

4 Layout of the PCB to which

WBR1-IPEX

applies

6.3 Production Instructions

SMT placement equipment

Reflow soldering machine

Automated optical inspection (AOI) equipment

Nozzle with a 6 mm to 8 mm diameter

static heat

-resistant trays

WBR1

-IPEX Datasheet

applies

Use an SMT placement machine to mount the stamp hole module that manufacturer

produces onto the PCB within 24 hours after the module is unpacked and the firmware

is burned. If not, vacuum pack the module again. Bake the module before mounting

it onto the PCB.

iii. Anti-

static heat

2.

Storage conditions for a delivered module are as

(1) The moisture-

proof bag is placed in an environment where the temperature is

below 30°C and the relative humidity is lower than 70%.

(2)

The shelf life of a dry

product is packaged and sealed.

(3) The p

ackage contains a humidity indicator card (HIC).

3.

Bake a module based on HIC status as follows when you unpack the module

package:

(1)

If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive

hours.

(2) If the 30%

circle is pink, bake the module for 4 consecutive hours.

(3)

If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4)

If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive

hours.

4. Baking settings:

(1)

Baking temperature

(2)

Alarm temperature: 130°C

(3)

SMT placement ready temperature after natural cooling: < 36°C

(4)

Number of drying times: 1

(5)

Rebaking condition: The module is not soldered within 12 hours after baking.

5.

Do not use SMT to process modules that have been unpacked for over three months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are

exposed to the air for over three months, they will be oxidized severely and dry joints

WBR1

14

static heat

-resistant gloves

Storage conditions for a delivered module are as

follows:

proof bag is placed in an environment where the temperature is

below 30°C and the relative humidity is lower than 70%.

The shelf life of a dry

-

packaged product is six months from the date when the

product is packaged and sealed.

ackage contains a humidity indicator card (HIC).

Figure 6-5 HIC for WBR1-IPEX

Bake a module based on HIC status as follows when you unpack the module

If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive

circle is pink, bake the module for 4 consecutive hours.

If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive

Baking temperature

: 125±5°C

Alarm temperature: 130°C

SMT placement ready temperature after natural cooling: < 36°C

Number of drying times: 1

Rebaking condition: The module is not soldered within 12 hours after baking.

Do not use SMT to process modules that have been unpacked for over three months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are

exposed to the air for over three months, they will be oxidized severely and dry joints

WBR1

-IPEX Datasheet

proof bag is placed in an environment where the temperature is

packaged product is six months from the date when the

Bake a module based on HIC status as follows when you unpack the module

If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive

circle is pink, bake the module for 4 consecutive hours.

If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive

Rebaking condition: The module is not soldered within 12 hours after baking.

Do not use SMT to process modules that have been unpacked for over three months.

Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are

exposed to the air for over three months, they will be oxidized severely and dry joints

o

6.

Before SMT placement, take electrostatic discharge (ESD) protective measures.

7.

To reduce the reflow defect rate, draw 10% of the products for visual inspection and

AOI before f

irst SMT placement to determine a proper oven temperature and

component placement method. Draw 5 to 10 modules every hour from subsequent

batches for visual inspection and AOI.

6.4 Recommended Oven Temperature Curve

Perform SMT placement based on the

highest temperature is 245°C.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

Figure 6

WBR1

15

Before SMT placement, take electrostatic discharge (ESD) protective measures.

To reduce the reflow defect rate, draw 10% of the products for visual inspection and

irst SMT placement to determine a proper oven temperature and

component placement method. Draw 5 to 10 modules every hour from subsequent

batches for visual inspection and AOI.

6.4 Recommended Oven Temperature Curve

Perform SMT placement based on the

following reflow oven temperature curve. The

highest temperature is 245°C.

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

Figure 6

-6 Oven temperature curve

WBR1

-IPEX Datasheet

Before SMT placement, take electrostatic discharge (ESD) protective measures.

To reduce the reflow defect rate, draw 10% of the products for visual inspection and

irst SMT placement to determine a proper oven temperature and

component placement method. Draw 5 to 10 modules every hour from subsequent

following reflow oven temperature curve. The

Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

r solder skips may occur. Manufacturer is not liable for such problems and consequences.

6.5 Storage Conditions

WBR1

16

6.5 Storage Conditions

WBR1

-IPEX Datasheet

7 MOQ and Packing

Product number MOQ（

pcs

WBR1-IPEX 4000

WBR1

17

7 MOQ and Packing

Information

pcs

） Shipping

packaging

method

Modules per reel

(pcs)

Tape reel 1000

WBR1

-IPEX Datasheet

Packaging reels

per box (reels)

4

8 Appendix: Statement

Federal Communications Commission (FCC) Declaration ofConformity

FCC Caution: Any changes or modifications not expresslyapproved by the party

responsible for compliance could void the user'sauthority to operate this equipment.

This device complies with Part 15 of the FCC Rules.Operation is subject to the following

two

conditions: (1) This device may notcause harmful interference, and (2) this device

must accept any interferencereceived, including interference that may cause undesired

operation.

Note:

This equipment has been tested and found to complywith the limits for

digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide

reasonable protection against harmfulinterference in a residential installation. This

equipment generates, uses andcan radiate radio frequency energy and, i

and used inaccordance with the instructions, may cause harmful interference to

radiocommunications. However, there is no guarantee that interference will notoccur in a

particular installation. If this equipment does cause harmfulinterferenc

television reception, which can be determined byturning the equipment off and on, the

user is encouraged to try to correct theinterference by one or more of the following

measures:

—

Reorient or relocate the receiving antenna.

—Increase the se

paration between the equipment and receiver.

—

Connect the equipment into an outlet on a circuit different from that to which

the receiver is connected.

—

Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This

equipment complies with FCC radiation exposure limits set forth for an

uncontrolledrolled environment. This equipment should be installed and operated with

minimumdistance 20cm between the radiator and your body.

Important Note

This radio module must not i

radios in host system

except in accordance with FCC multi

procedures.A

dditional testing and equipment authorization may berequired to operating

simultaneously with other radio

The availability of some specific channels and/or operational frequency bandsare country

dependent and are firmware programmed at the factory to matchthe intended

destination.The firmware setting is not accessible by the end user.

WBR1

18