SPA-MW21xx-M Wireless Audio Module User Manual

SUNPLUS TECHNOLOGY CO. reserves the right to change this documentation without prior notice. Information provided by SUNPLUS

TECHNOLOGY CO. is believed to be accurate and reliable. However, SUNPLUS TECHNOLOGY CO. makes no warranty for any errors which

may appear in this document. Contact SUNPLUS TECHNOLOGY CO. to obtain the latest version of device specifications before placing your

order. No responsibility is assumed by SUNPLUS TECHNOLOGY CO. for any infringement of patent or other rights of third parties which may

result from its use. In addition, SUNPLUS products are not authorized for use as critical components in life support systems or aviation systems,

where a malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written

approval of Sunplus.

SUNPLUS Technology Co., Ltd. www.sunplus.com

No.19, Innovation 1st Road. Hsinchu Science Park 30076, Taiwan, ROC

T: +886-3-5786005 F: +886-3-5786006

SPA-MW21xx-x

Wireless Audio Module

Datasheet

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SPA-MW21xx-M

1

Table of Content

1. Introductions ......................................................................................................................................2

2. Key Features .......................................................................................................................................3

3. Applications ........................................................................................................................................4

4. Module Pin Assignments ...................................................................................................................5

4.1 Module Package Outline ................................................................................................................5

SPA-MW21F3-M ................................................................................................................................................ 5

SPA-MW21F3-E ................................................................................................................................................ 7

4.2 Module PCB Pin Outline ................................................................................................................9

SPA MW21F3-M ................................................................................................................................................ 9

SPA- MW21F3-E ............................................................................................................................................. 10

4.3 Module Pin Type Definitions ......................................................................................................... 11

4.4 Tx Module Pinout Descriptions .................................................................................................... 11

4.5 Rx Module Pinout Descriptions ................................................................................................... 12

4.6 Soldering Specification ................................................................................................................ 13

5. Performance .................................................................................................................................... 15

5.1 Audio Specification (I2S to I2S), Fs=48KHz ............................................................................... 15

5.2 Audio Specification (I2S to I2S), Fs=96KHz ............................................................................... 15

5.3 Audio Specification (I2S to I2S), Fs=192KHz ............................................................................. 15

5.4 Channel Synchronization ............................................................................................................ 15

6. Electrical Characteristic ................................................................................................................. 16

6.1 Operation Condition .................................................................................................................... 16

6.2 Digital IO DC Characteristic ........................................................................................................ 16

6.3 WLAN 5G band RF Characteristic .............................................................................................. 16

6.4 BLE 2.4G band RF Characteristic ............................................................................................... 16

6.5 Power Consumption .................................................................................................................... 16

7. AC Characteristics .......................................................................................................................... 17

7.1 I2C Characteristics ...................................................................................................................... 17

7.2 I2S Characteristics ...................................................................................................................... 17

8. Module Part No. Description .......................................................................................................... 19

9. Version History ................................................................................................................................ 20

Add SPA-MW21M1-E information ........................................................................................................................ 20

Add Storage condition ........................................................................................................................................ 20

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1. Introductions

The SPA-MW21F3-X is a high performance wireless audio transceiver module, operating in both 5.2GHz and

5.8GHz WiFi bands. It offers 10Mbps bandwidth for lossless audio data transmission and delivers a stunning

audio quality, ideal for multi-channel and Hi-Res wireless audio applications.

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2. Key Features



Low audio latency

 Low audio jitter

 Lossless audio transmission

 Maximum transmission bandwidth/channels

 [email protected]/48KHz, 24bit

 4ch@96KHz, 24bit

 2ch@192KHz, 24bit

 Support 8ch I2S in/out with rich configurations

 master/slave mode

 16/24 bit

 44.1/48/96/192KHz sampling rate

 Radio frequency: 5.2G and 5.8G WiFi bands

 Dual antenna with diversity

 Adaptive channel selection algorithm

 Link distance up to 15m (w/o PA)

 Easy to integrate with MCUs, DSPs and amplifiers

 Bi-direction control channel

 Support OTA upgrade

 upgrading time is less than 60 seconds for 1T8R system

 Low standby power consumption

 Small foot print

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3. Applications

 Multi-channel wireless audio

 Hi-Res wireless audio

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4. Module Pin Assignments

4.1

Module Package Outline

SPA-MW21F3-M

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SPA-MW21F3-E

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4.2

Module PCB Pin Outline

SPA MW21F3-M

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SPA- MW21F3-E

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4.3

Module Pin Type Definitions

Pin Type

Definition

3.3V-I/O

Digital Tristate Output with 3.3V tolerance Schmitt Trigger Input

PWR

Power pin

GND

Ground Pin

4.4

Tx Module Pinout Descriptions

PIN No.

PIN Name

PIN Type

GPIO

Description

1

GND

Ground pin

2

NC

-

NC

3

UART_LOG_RX

3.3V-I/O

PB4

UART debug port

4

UART_LOG_TX

3.3V-I/O

PB5

UART debug port

5

FW_CFG_0

3.3V-I/O

PB6

Firmware configure pin 0

6

FW_CFG_1

3.3V-I/O

PB7

Firmware configure pin 1

7

FW_CFG_2

3.3V-I/O

PB8

Firmware configure pin 2

8

FW_CFG_3

3.3V-I/O

PB9

Firmware configure pin 3

9

PWM_LED1

3.3V-I/O

PB10

PWM LED control pin 1

10

GND

Ground pin

11

PWM_LED2

3.3V-I/O

PB13

PWM LED control pin 2

12

I2C_SDA

3.3V-I/O

PB14

I2C data

13

I2C_SCL

3.3V-I/O

PB15

I2C clock

14

I2S_IN_D3

3.3V-I/O

PB16

Audio data 3 digital input

15

I2S_IN_D2

3.3V-I/O

PB17

Audio data 2 digital input

16

I2S_IN_D1

3.3V-I/O

PB18

Audio data 1 digital input

17

I2S_IN_D0

3.3V-I/O

PB19

Audio data 0 digital input

18

I2S_IN_BCK

3.3V-I/O

PB20

Audio data bit clock input

19

I2S_IN_LRCK

3.3V-I/O

PB21

Audio data word clock input

20

I2S_IN_MCK

3.3V-I/O

PB22

Audio data master clock output

21

WAKEUP_TX

3.3V-I/O

PB30

Wakeup Tx module

22

NC

-

PB31

NC

23

CHIP_EN

3.3V-I/O

Reset pin

24

GND

Ground pin

25

VDD33

PWR

Power pin

26

GND

Ground pin

27

NC

-

PA8

NC

28

NC

-

PA12

NC

29

GND

Ground pin

30

NC

-

PA13

NC

31

NC

-

PA14

NC

32

NC

-

PA15

NC

33

NC

-

PA16

NC

34

NC

-

PA17

NC

35

NC

-

PA18

NC

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PIN No.

PIN Name

PIN Type

GPIO

Description

36

I2S_O_MCK

3.3V-I/O

PA19

Audio data master clock output

37

I2S_O_LRCK

3.3V-I/O

PA20

Audio data word clock output

38

I2S_O_D1

3.3V-I/O

PA21

Audio data 1 digital output

39

I2S_O_D0

3.3V-I/O

PA22

Audio data 0 digital output

40

I2S_O_BCK

3.3V-I/O

PA23

Audio data bit clock output

41

GND

Ground pin

42

I2S_O_D2

3.3V-I/O

PA26

Audio data 2 digital output

43

I2S_O_D3

3.3V-I/O

PA27

Audio data 3 digital output

44

TP

3.3V-I/O

PA28

Test Pin

45

TX_INT

3.3V-I/O

PA29

Tx interrupt to host

46

SWD_CLK

3.3V-I/O

PA30

SWD port

47

SWD_DATA

3.3V-I/O

PA31

SWD port

48

UART_TX

3.3V-I/O

PB0

UART control port

49

UART_RX

3.3V-I/O

PB1

UART control port

50

NC

-

PB2

NC

51

NC

-

PB3

NC

52

GND

Ground pin

53

NC

-

NC

54

GND

Ground pin

4.5

Rx Module Pinout Descriptions

PIN No.

PIN Name

PIN Type

GPIO

Description

1

GND

Ground pin

2

NC

-

NC

3

UART_LOG_RX

3.3V-I/O

PB4

UART debug port

4

UART_LOG_TX

3.3V-I/O

PB5

UART debug port

5

CH_CFG_0

3.3V-I/O

PB6

Channel configure pin 0

6

CH_CFG_1

3.3V-I/O

PB7

Channel configure pin 1

7

CH_CFG_2

3.3V-I/O

PB8

Channel configure pin 2

8

CH_CFG_3

3.3V-I/O

PB9

Channel configure pin 3

9

PWM_LED1

3.3V-I/O

PB10

PWM LED control pin 1

10

GND

Ground pin

11

PWM_LED2

3.3V-I/O

PB13

PWM LED control pin 2

12

I2C_SDA

3.3V-I/O

PB14

I2C data

13

I2C_SCL

3.3V-I/O

PB15

I2C clock

14

FW_CFG_0

3.3V-I/O

PB16

Firmware configure pin 0

15

FW_CFG_1

3.3V-I/O

PB17

Firmware configure pin 1

16

FW_CFG_2

3.3V-I/O

PB18

Firmware configure pin 2

17

FW_CFG_3

3.3V-I/O

PB19

Firmware configure pin 3

18

PAIR_KEY

3.3V-I/O

PB20

Pairing key

19

KEY1

3.3V-I/O

PB21

User key 1

20

KEY2

3.3V-I/O

PB22

User key 2

21

POWER_KEY

3.3V-I/O

PB30

Power key

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PIN No.

PIN Name

PIN Type

GPIO

Description

22

NC

-

NC

23

CHIP_EN

3.3V-I/O

Reset pin

24

GND

Ground pin

25

VDD33

PWR

Power pin

26

GND

Ground pin

27

NC

-

NC

28

NC

-

NC

29

GND

-

Ground pin

30

NC

-

NC

31

NC

-

NC

32

NC

-

NC

33

NC

-

NC

34

NC

-

NC

35

NC

-

NC

36

I2S_O_MCK

3.3V-I/O

PA19

Audio data master clock output

37

I2S_O_LRCK

3.3V-I/O

PA20

Audio data word clock output

38

I2S_O_D1

3.3V-I/O

PA21

Audio data 1 digital output

39

I2S_O_D0

3.3V-I/O

PA22

Audio data 0 digital output

40

I2S_O_BCK

3.3V-I/O

PA23

Audio data bit clock output

41

GND

Ground pin

42

I2S_O_D2

3.3V-I/O

PA26

Audio data 2 digital output

43

I2S_O_D3

3.3V-I/O

PA27

Audio data 3 digital output

44

/PA_RST

3.3V-I/O

PA28

Amp reset control

45

/PA_SD

3.3V-I/O

PA29

Amp shutdown/power down

46

SWD_CLK

3.3V-I/O

PA30

SWD port

47

SWD_DATA

3.3V-I/O

PA31

SWD port

48

/PA_FAULT

3.3V-I/O

PB0

Amp fault detection

49

AMP_PWR_EN

3.3V-I/O

PB1

Enable amp power

50

NC

-

NC

51

NC

-

NC

52

GND

Ground pin

53

NC

-

NC

54

GND

Ground pin

4.6

Soldering Specification

Solder Paste

Vendor: SMIC(Senju Metal Industry Co.,Ltd.)

Model No.: M705-GRN360-K2-V

Composition: Sn96.5/Ag3/Cu0.5

Powder size:Type-4(20~38μm)

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5. Performance

5.1

Audio Specification (I2S to I2S), Fs=48KHz

Parameter

Condition

Min.

Typ.

Max.

Unit

SNR(A)

1kHz, -60dB

20kHz LPF & A-weighted

144.5

dB

THD+N

1kHz, 0dB

20kHz LPF

-141.5

dB

Frequency response

Sweep FR: 20Hz~24KHz

-0.005

+0.005

dB

Dynamic Range(A)

1kHz, -60dB

20kHz LPF & A-weighted

144.5

dB

Latency

Pink noise

20.17

ms

5.2

Audio Specification (I2S to I2S), Fs=96KHz

Parameter

Condition

Min.

Typ.

Max.

Unit

SNR(A)

1kHz, -60dB

20kHz LPF & A-weighted

147.3

dB

THD+N

1kHz, 0dB

20kHz LPF

-141.5

dB

Frequency response

Sweep FR: 20Hz~48KHz

-0.005

+0.005

dB

Dynamic Range(A)

1kHz, -60dB

20kHz LPF & A-weighted

147.5

dB

Latency

Pink noise

20.15

ms

5.3

Audio Specification (I2S to I2S), Fs=192KHz

Parameter

Condition

Min.

Typ.

Max.

Unit

SNR(A)

1kHz, -60dB

20kHz LPF & A-weighted

150.3

dB

THD+N

1kHz, 0dB

20kHz LPF

-141.5

dB

Frequency response

Sweep FR: 20Hz~96KHz

-0.005

+0.005

dB

Dynamic Range(A)

1kHz, -60dB

20kHz LPF & A-weighted

150.5

dB

Latency

Pink noise

20.13

ms

5.4

Channel Synchronization

Parameter

Condition

Min.

Typ.

Max.

Unit

Channel synchronization

1T8R, 1KHz sine tone, Tx EVM Line-

in to Rx EVM Line-out

-1

-

+1

°

Audio jitter

1T8R

-2.78

--

+2.78

μs

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6. Electrical Characteristic

6.1

Operation Condition

Symbol

Parameter

Min.

Typ.

Max.

Unit

V

DD

External supply voltage

2.97

3.3

3.63

V

T

a

Ambient operating temperature

0

-

70

°C

T

a

Storage temperature

-40

25

85

°C

6.2

Digital IO DC Characteristic

Symbol

Parameter

Condition

Min.

Typ.

Max.

Unit

V

IL

I/O input low level voltage

V

IO

=3.3V±10%

-0.3

-

0.8

V

IH

I/O Input high level Voltage

V

IO

=3.3V±10%

2

-

V

OL

I/O output low voltage

V

IO

=3.3V±10%

-

0.15*V

IO

V

OH

I/O output high voltage

V

IO

=3.3V±10%

0.85* V

IO

-

V

6.3

WLAN 5G band RF Characteristic

Parameter

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Center channel frequency

5180

-

5825

MHz

Rx Sensitivity

HT20, MCS 7, 64-QAM rate 5/6

-

-74

-

dBm

HT40, MCS 7, 64-QAM rate 5/6

-

-70.5

-

dBm

Tx Power

HT20, MCS 7, 64-QAM rate 5/6

-

15

-

dBm

HT40, MCS 7, 64-QAM rate 5/6

-

15

-

dBm

6.4

BLE 2.4G band RF Characteristic

Parameter

Condition

Min.

Typ.

Max.

Unit

Frequency Range

Center channel frequency

2402

-

2480

MHz

Rx Sensitivity

PER < 30.8%

-

-99

-

dBm

Tx Power

At max. power output level

-

8

-

dBm

6.5

Power Consumption

Operating mode

Condition

Min.

Typ.

Max.

Unit

Tx module active

Tx EVM v1.1, 1T8R

-

370

-

mA

Rx module active

Rx EVM v1.1, 1T8R

-

65

-

mA

Tx module sleep

Tx EVM v1.1, 1T8R

-

3

-

mA

Rx module sleep

Rx EVM v1.1, 1T8R

-

3

-

mA

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7. AC Characteristics

7.1

I2C Characteristics

I2C timing data

I2C AC timing diagram

7.2

I2S Characteristics

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I2S timing data

I2S (Master) AC timing diagram

I2S (Slave) AC timing diagram

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8. Module Part No. Description

Brand name

SPA

Wi-Fi Module

MW

Body code

21

Wireless Audio

30

Audio Streaming

Memory size

1

2Mbytes

2

4Mbytes

3

8Mbytes

4

16 Mbytes

5

32Mbytes

6

64 Mbytes

7

128Mbytes

8

256Mbytes

Antenna

M

On module antenna

B

External PCB antenna

E

IPEX connector for external antenna

Version No.

W

Customer Name, Ex: S:Sunplus

X

Project No.

Y

Version No.

Z

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9. Version History

Revision

Date

By

Remark

V1.0

2024/07/31

Ricky Liu

Initial

V1.01

2024/08/09

Ricky Liu

Update performance and characteristic data

V1.2

2024/08/12

Ricky Liu

Update information for new module with BLE antenna (HDK-SM721DC3-

1V0)

V1.21

2024/08/26

Ricky Liu

Revised pin description

V1.22

2024/09/25

Ricky Liu

Update power consumption of standby mode

V1.23

2024/12/25

Ricky Liu

Revised module pin assignment

V1.3

2025/3/20

Ada

Add SPA-MW21M1-E information

V1.3.1

2025/4/2

Ada

Add Storage condition

V1.3.2

2025/4/29

Ada

Module part No. Description, Modify Module name

V1.3.3

2025/6/17

Cg.chen

Modify HT40 TX Power，add HT20 TX Power ，RX sensitivity

V1.3.4

2025/6/27

Cg.chen

modify RX sensitivity value

modify 4.1& 4.2 : module package

V1.4

2025/8/28

Ada

Add 4. 6 Soldering Specification

V1.4.1

2025/9/3

Ada

Modify Module Part No. description

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This module is intended for OEM integrators only.

Integration instructions for host product manufacturers

according to KDB 996369 D03 OEM Manual v01

KDB 996369 D03 OEM Manual v01 rule sections:

2.2 List of applicable FCC rules

This module has been tested for compliance to FCC Part 15.247/15.407.

2.3 Summarize the specific operational use conditions

The module is typically use in industrial, household and general office / ITE and audio & video, EV

charging system end-products. The product must not be co-located or operating in conjunction

with any other antenna or transmitters.

2.4 Limited module procedures

not applicable

2.5 Trace antenna designs

Not applicable.

2.6 RF exposure considerations

This equipment complies with FCC mobile radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with a minimum distance of 20cm

between the radiator & your body. If the module is installed in a portable host, a separate SAR

evaluation is required to confirm compliance with relevant FCC portable RF exposure rules.

2.7 Antennas

The following antennas have been certified for use with this module; antennas of the

same type with equal or lower gain may also be used with this module. The antenna must be

2.8 Label and compliance information

The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2BSO7-

SPAMW21XXM”. The grantee's FCC ID can be used only when all FCC compliance requirements are

met. 2.9 Information on test modes and additional testing requirements

This transmitter is tested in a standalone mobile RF exposure condition and any co-located or

simultaneous transmission with other transmitter(s) or portable use will require a separate class II

permissive change re-evaluation or new certification.

2.10 Additional testing, Part 15 Subpart B disclaimer

Host manufacturer is responsible for compliance of the host system with module installed with all other

applicable requirements for the system such as Part 15 B.

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer

considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM

integrator will be responsible for re-evaluating the end product (including the transmitter) and

obtaining a separate FCC authorization.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

OEM/Host manufacturer responsibilities

OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The

final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part

15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter

module for compliance with the Radio and EMF essential requirements of the FCC rules. This module

must not be incorporated into any other device or system without retesting for compliance as multi-

radio and combined equipment

This device complies with part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may cause

undesired operation.

Any Changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not

occur in a particular installation. If this equipment does cause harmful interference to

radio or television reception, which can be determined by turning the equipment off and

on, the user is encouraged to try to correct the interference by one or more of the

following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

-This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. This equipment should be installed and operated with

minimum distance 20cm between the radiator & your body.

SPA-MW21xx-M Wireless Audio Module

Product's Documents

User Manual

Specifications

Sunplus SPA-MW21xx-M Questions and Answers

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