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caso Pro Menu 1800
18
5.4.5 Switching off
When you switch off the appliance via “On/Standby” and the temperature of the burner is
lower than 120°F, the display shows “L”. When the temperature of the burner is over 120°F, it
is displaying “H”.
Please note
Do not place any empty cookware on the induction field. Heating an empty pot or pan
activates the overheating protection and the appliance turns off.
Do not operate the appliance if it is damaged in any way or does not function properly.
The use of accessories and spare parts not recommended by the manufacturer may lead to
damage of the appliance and injuries.
6 Cleaning and Maintenance
This chapter provides you with important notices with regard to cleaning and maintaining
the appliance. Please observe the notices to prevent damages.
6.1 Safety information
Attention
Please observe the following safety notices, before you clean the appliance:
The appliance must be cleaned and food residues must be removed regularly. If the
appliance is not maintained, this will have a negative effect on the service life.. It can also
result in the growth of mold and bacteria.
Switch the appliance off and unplug it from the power outlet before cleaning.
The cooktop can be hot after use. There is a danger of burning! Wait until the appliance has
cooled down.
Clean the appliance right after use after it has cooled down. Extended waiting
unnecessarily complicates cleaning and can make it impossible in extreme cases. Excessive
accumulations of dirt can even damage the appliance under certain circumstances.
If water gets into the appliance, this can damage the electronic components.
Attention
Do not dip the appliance into water or other liquids and do not place it in the dishwasher.
Do not use any aggressive or abrasive cleaning agents or solvents.
Do not use abrasive brushes for cleaning.
6.2 Cleaning
Ceramic cooktop, housing and operating panel
Clean the cooktop, the housing of the appliance and the operating panel with a soft, slightly
damp cloth.
Use a small brush to clean the ventilation openings and gaps at the bottom of the device.
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