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（Top View） （Bottom View）
Module Name: BL-M8800DU6-40L
WLAN +BLE USB Module
Module Type: 802.11a/b/g/n/ac 287Mbps WLAN +BLE v5.4 USB Module
Revision: V1.1
Customer Approval:
Company:
Title:
Signature:
Date:
Approval:
Title:
Signature:
Date:
Revision History
Revision
Summary
Release Date
Revised By
V1.0
Official release
2024-03-30
Garry
V1.1
Modify type of UART TX/RX
2024-12-04
Ch
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1. Introduction
BL-M8800DU6-40L is a highly integrated Dual-band WLAN+Bluetooth Combo module. It
combines a 1T1R Dual-band WLAN subsystem and a BLE v5.4 subsystem. This module compatible
IEEE 802.11 a/b/g/n/ac standard and provides the maximum PHY rate up to 287Mbps, offering
feature-rich wireless connectivity at high standards, and delivering reliable, cost-effective, high
throughput from an extended distance.
1.1 Features
Operating Frequencies: 2.4~2.4835GHz or 5.15~5.25GHz
Wireless PHY rate can reach up to 287Mbps with 20/40MHz bandwidth
Host Interface is USB2.0
Support STA, AP, WLAN Direct modes concurrently
Support BT Low Energy mode only
Connect to external antenna through IPEX-1 / MHF-1 connector
1.2 Block Diagram
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1.3 General Specifications
Module Name
BL-M8800DU6-40L
Chipset
AIC8800D40L
WLAN Standards
IEEE802.11a/b/g/n/ac
Host Interface
USB2.0 for WLAN & Bluetooth
Antenna
Connect to the external antenna through IPEX-1 / MHF-1 connector
Dimension
13.0*12.3*2.1mm (L*W*H; Tolerance: ±0.3mm_L/W, ±0.2mm_H)
Power Supply
3.3V±0.2V main power supply @700mA (Max)
Operation Temperature
-20℃ to +70℃
Operation Humidity
10% to 95% RH (Non-Condensing)
2. Pin Assignments
(Top view)
2.1 Pin Definition
No
Pin Name
Type
I/O Level
Module Pin Description
1
GND
RF
/
RF Ground connections
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2
ANT0
-
/
NC ( Reserved RF Pad )
3
VDD33
P
/
3.3V main power supply
4
USB_DM
A I/O
/
USB 2.0 Device High Speed Interface differential pair
5
USB_DP
A I/O
/
USB 2.0 Device High Speed Interface differential pair
6
GND
P
/
Ground connection
7
GND
RF
/
Auxiliary RF Ground connection PAD for ANT
(It can be left floating, but grounding is strongly
recommended to enhance ground connectivity and avoid
RF interference)
8
GND
P
/
Auxiliary Ground connection PAD for power and USB
(It can be left floating, but grounding is strongly
recommended to reduce the power loop area and avoid
interference with RF)
9
UART0_RX
I
VDD33
High-Speed UART Data In (Debug pin)
10
UART0_TX
O
VDD33
High-Speed UART Data Out (Debug pin)
J1
RF
/
IPEX-1 / MHF-1 connector for 2.4G WLAN/5G WLAN/2.4G
BT ANT
P: Power or Ground; I: Input; O :Output; A I/O: Analog In/Output; RF: Analog RF Port or RF Ground
3. Electrical and Thermal Specifications
3.1 Recommended Operating Conditions
Parameters
Min
Typ
Max
Units
Ambient Operating Temperature
-20
25
70
℃
External Antenna VSWR
1.7
2.1
/
Supply Voltage
VDD33
3.1
3.3
3.5
V
3.2 DC Electrical Specification (Recommended Operation Conditions)
Symbol
Description
Min
Typ
Max
Units
VIL
CMOS Low Level Input Voltage
0
--
0.3*VDD33
V
VIH
CMOS High Level Input Voltage
0.7*VDD33
--
VDD33
V
VTH
CMOS Threshold Voltage
--
0.5*VDD33
--
V
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3.3 Current Consumption
Conditions : USB,VDD33=3.3V; Ta:25℃；
Use Case
VDD33 Current
Typ(IRMS)
Max(IPeak)
Units
WLAN Unassociated (Linux USB Driver)
82
87
mA
2.4G WLAN throughput 180Mbps (Linux USB Driver)
181
340
mA
5G WLAN throughput 180Mbps (Linux USB Driver)
238
540
mA
2.4G 11b 1Mbps TX@18dBm (TX RF test)
88
295
mA
2.4G 11g 6Mbps TX@18dBm (TX RF test)
112
343
mA
2.4G 11n HT20_MCS0 TX@17dBm (TX RF test)
106
335
mA
5G 11a 6Mbps TX@17dBm (TX RF test)
168
519
mA
5G 11n HT20_MCS0 TX@17dBm (TX RF test)
163
527
mA
BT LE_1M TX@6dBm (BT RF test, WLAN disable)
40
52
mA
BT LE_1M RX Active (BT RF test, WLAN disable)
25
33
mA
4. WLAN & Bluetooth RF Specifications
4.1 2.4G RF Specification
Conditions : VDD33=3.3V ; Ta:25℃
Features
Description
WLAN Standard
IEEE 802.11b/g/n
Frequency Range
2.4~2.4835GHz (2.4GHz ISM Band)
Channels
Ch1~Ch13 (For 20MHz Channels)
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Modulation
802.11b (DSSS): DBPSK, DQPSK, CCK;
802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM;
802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM;
Data Rate
802.11b: 1, 2, 5.5, 11Mbps;
802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps;
802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps;
Frequency Tolerance
≦ ±20ppm
2.4G Transmitter Specifications ( TX power tolerance calibrated, customers can define the target TX power
within recommended range by modifying configuration file of the driver software, Customers must define
the TX power same or lower than recommended Target TX Power as below.）
TX Rate
Recommended Target TX
Power（dBm）
TX Power Tolerance
（dBm）
EVM
（dB）
802.11b@1Mbps
18
±2
≦-10
802.11b@11Mbps
18
±2
≦-10
802.11g@6Mbps
18
±2
≦-10
802.11g@54Mbps
16
±2
≦-25
802.11n@HT20_MCS0
17
±2
≦-10
802.11n@HT20_MCS7
15
±2
≦-28
802.11n@HT40_MCS0
17
±2
≦-10
802.11n@HT40_MCS7
15
±2
≦-28
2.4G Receiver Specifications
RX Rate
Min Input Level
（Typ. dBm）
Max Input Level
（Typ. dBm）
PER
802.11b@1Mbps
-96
-5
< 8%
802.11b@11Mbps
-88
-5
< 8%
802.11g@6Mbps
-92
-5
< 10%
802.11g@54Mbps
-75
-5
< 10%
802.11n@HT20_MCS0
-92
-5
< 10%
802.11n@HT20_MCS7
-73
-5
< 10%
802.11n@HT40_MCS0
-89
-5
< 10%
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802.11n@HT40_MCS7
-71
-5
< 10%
4.2 5G WLAN RF Specification
Conditions: VDD33=3.3V; Ta:25℃
Features
Description
WLAN Standard
IEEE 802.11a/n/ac
Frequency Range
5.15~5.25GHz (5GHz ISM Band)
Channels
Ch36, Ch40, Ch44, Ch48 (For 20MHz Channels)
Ch38, Ch46 (For 40MHz Channels)
Ch42 (For 80MHz Channels)
Modulation
802.11a (OFDM): BPSK, QPSK, QAM16, QAM64;
802.11n (OFDM): BPSK, QPSK, QAM16, QAM64;
802.11ac (OFDM): BPSK, QPSK, QAM16, QAM64, QAM256;
Data Rate
802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps;
802.11n (HT20): MCS0~MCS7 6.5~72.2Mbps;
802.11n (HT40): MCS0~MCS7 13.5~150Mbps;
802.11ac (VHT20): MCS0~MCS8(1T1R) 6.5~86.7Mbps;
802.11ac (VHT40): MCS0~MCS9(1T1R) 13.5~200Mbps;
Frequency Tolerance
≦ ±20ppm
5G Transmitter Specifications ( TX power tolerance calibrated, customers can define the target TX power
within recommended range by modifying configuration file of the driver software, Customers must define
the TX power same or lower than recommended Target TX Power as below.）
TX Rate
Recommended Target TX
Power（dBm）
TX Power Tolerance
（dBm）
EVM
（dB）
802.11a@6Mbps
17
±2
≦-10
802.11a@54Mbps
16
±2
≦-25
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802.11n@HT20_MCS0
17
±2
≦-10
802.11n@HT20_MCS7
15
±2
≦-28
802.11n@HT40_MCS0
17
±2
≦-10
802.11n@HT40_MCS7
15
±2
≦-28
802.11ac@VHT_40M_MCS0
16
±2
≦-10
802.11ac@VHT_40M_MCS9
14
±2
≦-32
5G Receiver Specifications
RX Rate
Min Input Level
（Typ. dBm）
Max Input Level
（Typ. dBm）
PER
802.11a@6Mbps
-90
-5
< 10%
802.11a@54Mbps
-74
-5
< 10%
802.11n@HT20_MCS0
-90
-5
< 10%
802.11n@HT20_MCS7
-71
-5
< 10%
802.11n@HT40_MCS0
-88
-5
< 10%
802.11n@HT40_MCS7
-68
-5
< 10%
802.11ac@VHT_40M_MCS0
-87
-5
< 10%
802.11ac@VHT_40M_MCS9
-62
-5
< 10%
4.3 Bluetooth RF Specification
Conditions: VDD33 =3.3V; Ta:25℃
Features
Description
Bluetooth Specification
Bluetooth Core Specification v5.4/v4.2/v4.0
Frequency Range
2.4~2.4835GHz(2.4GHz ISM Band)
Channels
Blue Low Energy: Ch0~Ch39 (For 2MHz Channels);
Power Classes
Bluetooth Low Energy: Class1.5;
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Data Rate & Modulation
LE_125Kbps: GFSK (Coded_S=8);
LE_500Kbps: GFSK (Coded_S=2);
LE_1Mbps: GFSK (Uncoded);
LE_2Mbps: GFSK (Uncoded);
Bluetooth Transmitter Specifications
Items
Min（dBm）
Typ（dBm）
Max（dBm）
TX Power
LE_125/500K
3
7
10
LE_1M
3
7
10
LE_2M
3
7
10
LE_1M Modulation Characteristics
Δf1avg
225KHz
250.7KHz
275KHz
Δf2avg
185KHz
252.9KHz
275KHz
Δf2max
185KHz
245.5KHz
/
Δf2avg/Δf1avg
0.8
0.98
/
LE_2M Modulation Characteristics
Δf1avg
450KHz
494KHz
550KHz
Δf2avg
370KHz
504KHz
550KHz
Δf2max
370KHz
529KHz
/
Δf2avg/Δf1avg
0.8
1.1
/
Bluetooth Receiver Specifications
Items
Sensitivity
Maximum Input Level
Input Level
(Typ. dBm）
PER
Input Level
(Typ. dBm）
PER
LE_125/500K
-90
≦5%
-5
≦5%
LE_1M
-88
≦5%
-5
≦5%
LE_2M
-84
≦5%
-5
≦5%
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5. Mechanical Specifications
5.1 Module Outline Drawing（units:mm）
(Top View) (Side View) (Bottom View)
Module dimension: 13.0*12.3*2.1mm (L*W*H; Tolerance: ±0.3mm_L/W, ±0.2mm_H)
IPEX-1 / MHF-1 connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm)
Module Bow and Twist：≤0.1mm
5.2 Mechanical Dimensions（units:mm）
(Top View) (Bottom View)
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6. Application Information
6.1 Typical Application Circuit
6.2 HW Application Note
6.2.1 VDD33 Power requirement：
A、DC 3.1~3.5V & Ripple Voltage <100mV power supply input, Maximum RMS current≥500mA and Maximum
Peak current≥700mA.
B、For achieve fast transient response，a current mode buck converter recommended.
C、On customer's motherboard, use 10uF and 100nF MLCC capacitors close to the module's VDD33 Pin for
power input decoupling. Each GND Pin has three close vias to ensure connectivity and thermal conductivity.
6.2.2 USB interface Design Guidelines：
A、The module provides a USB device interface which is compatible with USB2.0 specification, High-Speed
mode supports data transmission rate up to 480Mbps.
B 、 On customer's motherboard, PCB traces of the USB high-speed signal pair should be maintain 90
differential impedance, structure of “ Differential Coated Coplanar Waveguide With Ground ” with the
advantages of impedance control and GND surrounding isolation interference may be an ideal choice. To
avoid interference, USB signal pair must be far away from power, RF and other signals, GND copper can be
used to surround and isolate them.
C、PCB traces of the USB high-speed signal pair as short as possible, as far away from other signal as possible,
minimize the length mismatch of signal pair, avoid layer change and maintain a complete reference layer to
reduces signal reflections and impedance changes.
D、If It is necessary to change layers for USB signal pair routing, use GND vias close to signal pair's vias as the
shortest return path.
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7. Key Components Of Module
No.
Parts
Specification
Manufacturer
Note
1
Chipset
AIC8800D40L
AIC Semiconductor (Shanghai) CO.,LTD
2
PCB
BL-M8800DU6
SHEN ZHEN QILI ELECTRON CO.,LTD
Quzhou Sunlord Electronics Co.,Ltd
ShenZhen Tie Fa Technology Limited
3
Crystal
40MHz-3225
LUCKI CM ELECTRONICS CO.,LTD
Chengde oscillator Electronic Technology CO.,LTD
JinHua East Crystal Electronic CO.,LTD
HUBEI TKD CRYSTAL ELECTRONIC SCIENCE AND TECHNOLOGY CO.,LTD
4
Diplexer
DIP1608
Shenzhen Sunlord Electronics Co.,Ltd
Dongguan Hekang Electronics Co.,LTD
Shenzhen FTR Technologies CO., LTD
Walsin Technology Corporation
8. Package and Storage Information
8.1 Package Dimensions
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Package specification:
1. 1,000 modules per roll and 5,000 modules per box.
2. Outer box size: 37.5*36*29cm.
3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 28mm (with a
width of 24mm carrying belt).
4. Put 1 package of dry agent (20g) and 1 humidity card in each anti-static vacuum bag.
5. Each carton is packed with 5 boxes.
8.2 Storage Conditions
Absolute Maximum Ratings:
Storage temperature: -40℃ to +85℃
Storage humidity: 10% to 95% RH（Non-Condensing）
Recommended Storage Conditions:
Storage temperature: 5℃ to +40℃
Storage humidity: 20% to 90% RH
Please use this Module within 12month after vacuum-packaged.
The Module shall be stored without opening the packing.
After the packing opened, the Module shall be used within 72hours.
When the color of the humidity indicator in the packing changed,
the Module shall be baked before soldering.
Baking condition: 60℃, 24hours, 1time.
ESD Sensitivity：
ESD Protection: 2KV(HBM, Maximum rating)
The Module is a static-sensitive electronic device.
Do not operate or store near strong electrostatic fields.
Take proper ESD precautions!
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Caution: The user is cautioned that changes or
modifications not expressly approved by the party
responsible for compliance could void the user's authority
to operate the equipment.
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2) this
device must accept any interference received, including
interference that may cause undesired operation.
NOTE: This equipment has been tested and found to
comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference
in a residential installation. This equipment generates, uses
and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may
cause harmful interference to radio communications.
However, there is no guarantee that interference will not
occur in a particular installation.
If this equipment does cause harmful interference to radio
or television reception, which can be determined by
turning the equipment off and on, the user is encouraged
to try to correct the interference by one or more of the
following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and
receiver.
-- Connect the equipment into an outlet on a circuit
different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV
technician for help.
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure
limits set forth for an uncontrolled environment. This
transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
This equipment should be installed and operated with a
minimum distance of 20cm between the radiator and your
body.
The module in this product is labeled with its own FCC ID.
The FCC ID is not visible when the module is installed
inside another device. Therefore, the outside of the device
into which the module is installed must also display a label
referring to the module. The final end device must be
labeled in a visible area with the following
“Contains FCC ID: 2ANCG-M8800DU6”
The user manual for LE-LAN devices shall contain
instructions related to the restrictions mentioned in the
above sections, namely that:
i. the device for operation in the band 5150–5250 MHz is
only for indoor use to reduce the potential for harmful
interference to co-channel mobile satellite systems;
ii. for devices with detachable antenna(s), the maximum
antenna gain permitted for devices in the bands 5250-
5350 MHz and 5470-5725 MHz shall be such that the
equipment still complies with the e.i.r.p. limit;
iii. for devices with detachable antenna(s), the maximum
antenna gain permitted for devices in the band 5725-5850
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MHz shall be such that the equipment still complies with
the e.i.r.p. limits as appropriate; and
iv. where applicable, antenna type(s), antenna models(s),
and worst-case tilt angle(s) necessary to remain compliant
with the e.i.r.p. elevation mask requirement set forth in
section 6.2.2.3 shall be clearly indicated.
This equipment should be installed and operated with a
minimum distance of 20cm between the radiator and your
body.
Cet équipement doit être installé et utilisé à une distance
minimum de 20 cm entre l’antenne et votre corps.
