Contents
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Scope of applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Smart kit interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1. Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1. Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2. Normal operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3. Power consumption during continuous transmission and
reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4. Operating current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. RF parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1. Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2. Transmitter (TX) performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3. Receiver (RX) performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5. Antenna information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1. Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.2. Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6. Packing and production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1. Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2. Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.3. Recommended oven temperature curve . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.4. Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7. MOQ and packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8. Appendix: Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
I
1Overview
MDWBRCU2D smart kit is a Wi-Fi and Bluetooth Low Energy (LE) combo smart kit
developed by Tuya Smart. It consists of a highly integrated wireless RF chip
RTL8711DAF and a few peripheral components, with built-in Wi-Fi and Bluetooth
network protocol stacks and various library functions.
1 / 32
1Overview
1. Overview
The smart kit is built around a 32-bit low power MCU with 512 KB SRAM, built-in 4
MB ash memory, and various peripheral resources.
MDWBRCU2D is a real-time operating system (RTOS), integrated with all Wi-Fi
MAC and TCP/IP libraries. All these resources can help you develop your own
embedded Wi-Fi products.
1.1. Features
• Built-in low-power 32-bit CPU that also acts as an application processor.
• Clock rate of up to 345 MHz.
• Operating voltage range: 5.0 ± 0.5 V.
• Peripherals: 1 universal asynchronous receiver/transmitter (UART).
• Wi-Fi connectivity
• IEEE 802.11a/b/g/n 1x1, 2.4 GHz and 5 GHz.
• Channel 1 to 14 at 2.4 GHz, and 36-177 at 5 GHz.
• Support security protocols, including WPA2, WPA2 PSK (AES), and WPA3.
• The maximum output power is +18 dBm for IEEE 802.11b and 802.11a
transmission.
• Support STA, AP, and STA + AP combo working modes. Except for UNII-2A/2C.
• Support two pairing modes, namely Wi-Fi Easy Connect (EZ mode) and access
point (AP) mode. Both modes are suitable for pairing with Android and iOS
devices.
• Onboard PCB antenna with a gain of 0.88 dBi at 2.4 GHz, and 1.53 dBi at 5
GHz.
• Operating temperature range: −40°C to 105°C.
• Bluetooth connectivity
• Support Bluetooth 5.0.
• Up to +8 dBm output power.
• Onboard PCB antenna with a gain of 0.88 dBi at 2.4 GHz, and sharing the same
antenna with Wi-Fi.
• Operating temperature range: −40°C to 105°C.
2 / 32
1.2. Scope of applications
•
Smart home and electrical appliance
3 / 32
2. Smart kit Interface
2.1. Dimensions and footprint
The MDWBRCU2D dimensions are 50.78 ± 0.35 mm (W) × 18±0.35 mm (L) ×
4.52 ± 0.15 mm (H). The gure below shows the dimensions of the MDWBRCU2D
.
4 / 32
3.2Electrical parameters
3. Electrical parameters
3.1. Absolute electrical parameters
Parameter Description Min value Max value Unit
Ts
Storage
temperature
−40 125 °C
VBAT
Supply
voltage
3.6 6.0 V
Electrostatic
discharge
voltage
(human body
model)
TAMB ≤ 25°C - 2 kV
Electrostatic
discharge
voltage
(machine
model)
TAMB ≤ 25°C - 0.5 kV
3.2. Normal operating conditions
Parameter Description Min value
Typical
value
Max value Unit
Ta
Operating
temperature
−40 - 105 °C
VBAT
Supply
voltage
4.5 5.0 5.5 V
VIL
I/O low-
level input
- - 0.8 V
VIH
I/O high-
level input
2.0 - - V
5 / 32
4.3RF parameters
Parameter Description Min value
Typical
value
Max value Unit
VOL
I/O low-
level
output
0 - 0.3 V
VOH
I/O high-
level
output
2.8 - 3.6 V
Imax
I/O drive
current
- - 12 mA
3.3. Power consumption during continuous transmission and
reception
2.4 GHz transmission and reception
Operating
status
Mode Rate
Transmit/
Receive
power
Typical
value
Unit
Transmit 802.11b 1 Mbit/s +19 dBm 175 mA
Transmit 802.11b 11 Mbit/s +19 dBm 180 mA
Transmit 802.11g 6 Mbit/s +19 dBm 177 mA
Transmit 802.11g 54 Mbit/s +18 dBm 161 mA
Transmit
802.11n-
HT20
MCS0 +19 dBm 175 mA
Transmit
802.11n-
HT20
MCS7 +17 dBm 151 mA
Transmit
802.11n-
HT40
MCS0 +19 dBm 180 mA
Transmit
802.11n-
HT40
MCS7 +17 dBm 161 mA
Receive 802.11b 1 Mbit/s
Continuous
reception
29 mA
Receive 802.11b 11 Mbit/s
Continuous
reception
29 mA
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4.4RF parameters
Operating
status
Mode Rate
Transmit/
Receive
power
Typical
value
Unit
Receive 802.11g 6 Mbit/s
Continuous
reception
29 mA
Receive 802.11g 54 Mbit/s
Continuous
reception
29 mA
Receive
802.11n-
HT20
MCS0
Continuous
reception
29 mA
Receive
802.11n-
HT20
MCS7
Continuous
reception
29 mA
Receive
802.11n-
HT40
MCS0
Continuous
reception
31 mA
Receive
802.11n-
HT40
MCS7
Continuous
reception
31 mA
5 GHz transmission and reception
Operating
status
Mode Rate
Transmit/
Receive
power
Typical
value
Unit
Transmit 802.11a 6 Mbit/s +19 dBm 238 mA
Transmit 802.11a 54 Mbit/s +17 dBm 216 mA
Transmit
802.11n-
HT20
MCS0 +19 dBm 242 mA
Transmit
802.11n-
HT20
MCS7 +16 dBm 208 mA
Transmit
802.11n-
HT40
MCS0 +19 dBm 240 mA
Transmit
802.11n-
HT40
MCS7 +16 dBm 206 mA
Receive 802.11a 6 Mbit/s
Continuous
reception
32 mA
Receive 802.11a 54 Mbit/s
Continuous
reception
32 mA
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4.4RF parameters
Operating
status
Mode Rate
Transmit/
Receive
power
Typical
value
Unit
Receive
802.11n-
HT20
MCS0
Continuous
reception
32 mA
Receive
802.11n-
HT20
MCS7
Continuous
reception
32 mA
Receive
802.11n-
HT40
MCS0
Continuous
reception
33 mA
Receive
802.11n-
HT40
MCS7
Continuous
reception
33 mA
The above data is powered by a DC steady-state power supply at 5.0
V, utilizing a 100% duty cycle forced transmission mode. There are slight
dierences in data across dierent smart kit.
3.4. Operating current
Working
mode
Working
status, Ta =
25°C
Average
value
Max value
(Typical
value)
Unit
Fast network
conguration
(AP)
The smart kit is
in fast
network
conguration
state and the
Wi-Fi indicator
ashes slowly.
34.1 319 mA
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4.5RF parameters
Working
mode
Working
status, Ta =
25°C
Average
value
Max value
(Typical
value)
Unit
Fast network
conguration
(Bluetooth)
The smart kit is
in Bluetooth
pairing state
and the Wi-Fi
indicator
ashes fast.
31.6 308 mA
No operation
during
network
connection
The smart kit is
in an idle
networking
working state
and the Wi-Fi
indicator is
always on.
29.2 302 mA
Operations
are being
performed
during
network
connection
The smart kit is
in a
networked
operational
state and the
Wi-Fi indicator
is always on.
30 308 mA
Weak network
state
The smart kit is
in a wireless
signal weak
network
connection
working state
and the Wi-Fi
indicator is
o.
34.6 314 mA
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4.5RF parameters
Working
mode
Working
status, Ta =
25°C
Average
value
Max value
(Typical
value)
Unit
Disconnected
state
The smart kit is
disconnected
and the Wi-Fi
indicator is
o.
31.9 313 mA
The router is
not powered
The smart kit is
in a working
state where
the router is
powered o
and
disconnected
from the
internet and
the Wi-Fi
indicator is
o.
31.8 307 mA
The above data is powered by a DC steady-state power supply of 5.0
V and is based on the Tuya universal rmware, with rmware version number
v1.0.1. There are slight dierences in test data for dierent smart kit with the
same rmware.
10 / 32
4.5RF parameters
4. RF parameters
4.1. Basic RF features
Parameter Description
Operating frequency
2.412 GHz to 2.484 GHz (Ch1-11 for
US/CA, Ch1-13 for EU/CN), 5.180-5.825
GHz
Wi-Fi standard
IEEE 802.11a/b/g/n (Ch1-11 for US/CA,
Ch1-13 for EU/CN, and 36-177)
Bluetooth standard Bluetooth LE 5.0
Data transmission rate
• 11b: 1, 2, 5.5, and 11 Mbit/s
• 11a/g: 6, 9, 12, 18, 24, 36, 48, and
54 Mbit/s
• 11n: HT20 MCS0-7, and HT40
MCS0-7
• Bluetooth 5.0: 1 Mbit/s /2 Mbit/s
Antenna type
Onboard PCB antenna with a gain of
0.88 dBi at 2.4 GHz, and 1.53 dBi at 5
GHz.
4.2. Transmitter (TX) performance
2.4 GHz continuous transmission performance
Parameter Min value Typical value Max value Unit
RF average
output power,
802.11b CCK
mode, 11
Mbit/s
- 18 - dBm
11 / 32
5.3Antenna information
Parameter Min value Typical value Max value Unit
RF average
output power,
802.11g
OFDM mode,
54 Mbit/s
- 17 - dBm
RF average
output power,
802.11n HT20
mode, MCS7
- 15 - dBm
RF average
output power,
802.11n HT40
mode, MCS7
- 15 - dBm
RF average
output power,
Bluetooth 5.0,
1 Mbit/s/2
Mbit/s
- 8 - dBm
Frequency
error
−10 - 10 ppm
5 GHz continuous transmission performance
Parameter Min value Typical value Max value Unit
RF average
output power,
802.11a
OFDM mode,
54 Mbit/s
- 16 - dBm
RF average
output power,
802.11n HT20
mode, MCS7
- 15 - dBm
12 / 32
5.3Antenna information
Parameter Min value Typical value Max value Unit
RF average
output power,
802.11n HT40
mode, MCS7
- 15 - dBm
Frequency
error
−10 - 10 ppm
4.3. Receiver (RX) performance
RX sensitivity
Parameter Min value Typical value Max value Unit
PER < 8%, RX
sensitivity,
802.11b DSSS
mode, 11
Mbit/s
- −91 - dBm
PER < 10%,
RX sensitivity,
802.11a/g
OFDM mode,
54 Mbit/s
- −75 - dBm
PER < 10%,
RX sensitivity,
802.11n
OFDM mode,
HT20-MCS7
- −72 - dBm
PER < 30.8%,
RX sensitivity,
Bluetooth 5.0,
1 Mbit/s
- −98 - dBm
13 / 32
5.4Antenna information
Parameter Min value Typical value Max value Unit
PER < 30.8%,
RX sensitivity,
Bluetooth 5.0,
2 Mbit/s
- −94 - dBm
14 / 32
5.4Antenna information
5. Antenna information
5.1. Antenna type
Only the PCB antenna applies.
5.2. Antenna interference reduction
When a PCB antenna is used on a Wi-Fi smart kit, we recommend that the
antenna be at least 15 mm away from other metal components. This can
optimize the Wi-Fi performance.
Make sure that the enclosure surrounding the antenna is not traced or lled with
copper. Otherwise, the RF performance might be degraded. Layout principles: No
substrate medium exists directly below or above the PCB antenna. The PCB
antenna is away from the copper sheet. This can maximize the radiation eect of
the antenna.
15 / 32
6.3Packing and production
instructions
Refer to the mechanical dimensions below for the PCB onboard
antenna area.
16 / 32
6.3Packing and production
instructions
6. Packing and production instructions
6.1. Mechanical dimensions
The MDWBRCU2D’s PCB dimensions are 35.2 ± 0.35 mm (W) × 18 ± 0.35
mm (L) × 1.0 ± 0.1 mm (H). The gure below shows the mechanical dimensions
of MDWBRCU2D.
17 / 32
7.2MOQ and packaging information
18 / 32
7.2MOQ and packaging information
19 / 32
7.2MOQ and packaging information
20 / 32
7.2MOQ and packaging information
The default tolerance of the dimensions is ± 0.35 mm. If you have special
requirements for key dimensions, specify them in the datasheet after
consultations.
6.2. Production instructions
• For the smart kit that can be packaged with the surface-mount technology
(SMT) or in in-line form, you can select either of them according to the PCB
design solutions of customers. If a PCB is designed to be SMT-packaged,
package the smart kit SMT. If a PCB is designed to use an in-line
package, use wave soldering. Complete soldering within 24 hours after the
smart kit is unpacked. Otherwise, we recommend that you place the smart kit
drying cupboard with a relative humidity level below 10%, or pack the smart kit
in vacuum again. Then, record the packing time and duration of exposure. The
total exposure time cannot exceed 168 hours.
• Instruments or devices required for the SMT process:
• Surface mount system
• Solder Paste Inspection (SPI)
• Reow soldering machine
• Thermal proler
• Automated optical inspection (AOI) device
• Instruments or devices required for the wave soldering process:
• Wave soldering device
• Wave soldering xture
• Constant-temperature soldering iron
• Tin bar, tin wire, and ux
• Thermal proler
• Instruments or devices required for the baking process:
• Cabinet oven
• Electrostatic discharge (ESD) protection and heat-resistant trays
• ESD protection and heat-resistant gloves
21 / 32
7.3MOQ and packaging information
•
A delivered smart kit meet the following storage requirements:
• The moisture-proof bag must be placed in an environment where the
temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.
• A humidity indicator card (HIC) is put in the sealed package.
• The smart kit needs to be baked in the following cases:
• The vacuum packaging bag is damaged before unpacking.
• After unpacking, no HIC is found in the packaging bag.
• After unpacking, the HIC indicates a humidity level of 10% or higher. In this
case, the circle turns pink on the HIC.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the rst sealing of the bag.
• The baking parameter settings are described below:
• Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And
125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant
tray, rather than a plastic container).
• Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
• Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray
packaging.
• Production can begin after a smart kit has cooled down to below 36°C under
natural conditions.
• If a smart kit remains unused for over 168 hours after being baked, it needs to
be baked again.
•
If a batch of smart kit is not baked after exposure for more than 168 hours, do
not use wave soldering to solder them. Because these smart kit are level-3
moisture-sensitive devices, they are very likely to get damp when exposed
22 / 32
7.3MOQ and packaging information
beyond the allowable time. In this case, if they are soldered at high
temperatures, device failure or poor soldering performance might occur.
• In the whole production process, take electrostatic discharge (ESD) protective
measures.
• To guarantee the pass rate, we recommend that you use the SPI and AOI to
monitor the quality of solder paste printing and mounting.
6.3. Recommended oven temperature curve
Select a proper soldering technique according to the process. For more
information, refer to the recommended oven temperature curve of either reow
soldering or wave soldering. The set temperatures might deviate from the actual
temperature measurements. All temperatures shown in this smart kit datasheet
are obtained through actual measurements.
Technique 1: SMT process (recommended oven temperature curve of
reow soldering)
Set the oven temperatures according to the following curve.
• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
23 / 32
7.4MOQ and packaging information
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period of 60 s
to 120 s
• F: temperature above liquidus temperature for 50 s to 70 s
• G: peak temperature from 235°C to 245°C
•
H: ramp-down slope from 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information
about other solder pastes, see the recommended oven temperature curve
in the specied solder paste specications.
Technique 2: Wave soldering process (oven temperature curve of wave
soldering)
Set the oven temperatures according to the following temperature curve of wave
soldering. The peak temperature is 260°C ± 5°C.
Suggestions on
wave soldering
Suggestions on
manual repair
soldering
24 / 32
7.4MOQ and packaging information
Suggestions on
wave soldering
Suggestions on
manual repair
soldering
Preheat
temperature
80°C to 130°C
Soldering
temperature
360°C ± 20°C
Preheat duration 75 s to 100 s Soldering duration
Less than 3 s/
point
Contact duration
at the peak
3 s to 5 s N/A N/A
Solder tank
temperature
260°C ± 5°C N/A N/A
Ramp-up slope ≤ 2°C/s N/A N/A
Ramp-down slope ≤ 6°C/s N/A N/A
25 / 32
7.4MOQ and packaging information
6.4. Storage conditions
26 / 32
7.5MOQ and packaging information
7. MOQ and packaging information
Product
model
MOQ (pcs)
Shipping
packaging
Smart kit per
reel
Reels per
carton
MDWBRCU2D 3600 Tape and reel 900 4
27 / 32
8Appendix: Statement
8. Appendix: Statement
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this smart kit
product is in compliance with essential requirements and other relevant
provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of
conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance
with the EU directive for waste electrical and electronic equipment
(WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point
of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of20cm from the human
body.
FCC Caution: Any changes or modications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
28 / 32
NOTE: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
29 / 32
with a minimum distance of 20cm between the radiator and your body.
uncontrolled rolled environment. This device should be installed and operated
This device complies with FCC radiation exposure limits set forth for an
Radiation Exposure Statement
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
—Consult the dealer or an experienced radio/TV technician for help.
30 / 32
l’utilisation de codes répétitifs lorsque cela est requis par la technologie.
interdire la transmission d’informations de contrôle ou de signalisation ou
transmettre ou de panne opé rationnelle. Notez que ceci n’est pas destiné à
interrompre automatiquement la transmission en cas d’absence d’informations à
de distance entre la source de rayonnement et votre corps. L’appareil peut
contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm
limites d’exposition aux rayonnements ISED établies pour un environnement non
Déclaration d’exposition aux radiations:
Cet équipement est conforme aux
your body.
be installed and operated with minimum distance 20 cm between the radiator &
exposure limits set forth for an uncontrolled environment. This equipment should
Radiation Exposure Statement
This equipment complies with IC radiation
si le brouillage est susceptible d’en compromettre le fonctionnement.
l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique sub i, même
conditions suivantes: (1) l’appareil ne doit pas produire de brouillage. (2)
aux appareils radio exempts de licence. L’exploitation est autorisée aux deux
device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables
interference, including interference that may cause undesired operation of the
This device may not cause interference. (2) This device must accept any
licence-exempt RSSs. Operation is subject to the following two conditions: (1)
Industry Canada Statement
This device complies with Industry Canada’s
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les
conditions suivantes: (Pour utilisation de dispositif smart kit) (1) L’antenne
doit être installée de telle sorte qu’une distance de 20 cm est respectée entre
l’antenne et les utilisateurs. (2) Le smart kit émetteur peut ne pas être coïmplanté
avec un autre é metteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplé mentaires sur
l’émetteur neseront pas nécessaires. Toutefois, l’intégrateur OEM est toujours
responsable des essais sur son produit nal pour toutes exigences de conformité
supplémentaires requis pour ce smart kit installé.
IMPORTANT NOTE: In the event that these conditions can not be met (for
example certain laptop congurations or colocation with another transmitter),
then the Canada authorization is no longer considered valid and the IC ID can not
be used on the nal product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites
(par exemple pour certaines congurations d’ordinateur portable ou de certaines
co-localisation avec un autre émetteur), l’autorisation du Canada n’est plus
considéré comme valide et l’ID IC ne peut pas être utilisé sur le produit nal.
Dans ces circonstances, l’intégrateur OEM sera chargé de réévaluer le produit
nal (y compris l’émetteur) et l’obtention d’une autorisation distincte au Canada.
End Product Labeling This transmitter smart kit is authorized only for use in
device where the antenna may be installed such that 20 cm may be maintained
between the antenna and users.
Plaque signalétique du produit nal Ce smart kit émetteur est autorisé
uniquement pour une utilisation dans un dispositif où l’antenne peut être
installée de telle sorte qu’une distance de 20cm peut être maintenue entre
l’antenne et les utilisateurs.
31 / 32
Operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for
harmful
interference to co-channel mobile satellite systems.
32 / 32
Les dispositifs fonctionnant dans la bande 5150-5250 MHz sont réservés uniquement pour une
utilisation à l'interieur afin de reduire les risques de brouillage prejudiciable aux systemes de
satellites mobiles utilisant les mémes canaux.
Operation in the band 5150-5250MHz and 5250-5350MHz are not permitted to be used on
airplanes.
Les dispositifs certifiés en vertu de la présente section ne sont pas autorisés à être utlisés dans
les avions.
(Gamme de fréquences:5150-5250MHz and 5250-5350MHZ)
The use of Wi-Fi 5GHz Band 1 is strictly limited to indoor environment.
CAN ICES (B) / NMB (B)
