Contents
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Scope of applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Module interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1. Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3. Electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1. Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2. Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3. Radio frequency (RF) power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.4. Power consumption in operating mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. RF parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1. Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.2. Transmitter (TX) performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5. Antenna information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1. Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2. Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6. Power-on and power-o sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1. Power-on sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2. Power-o sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7. Footprint and production instructions . . . . . . . . . . . . . . . . . . . . . . . 16
7.1. Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2. Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3. Recommended oven temperature curve . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.4. Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
8. MOQ and packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
9. Appendix: Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
I
1Overview
The HEWBRQU2 module is a Wi-Fi and Bluetooth Low Energy (LE) combo module
developed by Tuya Smart. This module consists of a highly integrated wireless RF
chip W701-VA2-CG with built-in Wi-Fi stacks and various library functions.
1 / 28
1Overview
1. Overview
HEWBRQU2 combines a low-power KM4 microcontroller unit (MCU), WLAN MAC,
and 1T1R (1 transmitter/1 receiver) design. This module provides output
frequency up to 100 MHz, 256 KB embedded SRAM, 2 MB ash memory, and
congurable GPIOs that can function as digital peripherals for diverse
applications.
HEWBRQU2 is a real-time operating system (RTOS), integrated with all Wi-Fi MAC
and TCP/IP libraries. All these resources can help you develop your own
embedded Wi-Fi products.
1.1. Features
• Built-in low-power KM4 MCU that also acts as an application processor.
• Clock rate of 100 MHz.
• Operating voltage range: 4.5V to 18V.
• Peripheral: 1 universal asynchronous receiver/transmitter (UART).
• Wi-Fi and Bluetooth connectivity
• IEEE 802.11b/g/n20.
• Channels 1–[email protected] GHz (CH1–11 for US/CA and CH1–13 for EU/CN).
• Support security protocols, including WEP, WPA, WPA2, and WPA2 PSK (AES).
• Support Bluetooth LE 4.2.
• Support Wi-Fi Easy Connect (EZ mode) pairing mode on Android and iOS
devices.
• Onboard PCB antenna.
• It has passed CE and FCC certications.
• Operating temperature range: −20°C to +85°C.
1.2. Scope of applications
• Smart building
• Smart home
• Smart socket
• Smart lighting
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2.3Module interfaces
• Smart bus
• Industrial wireless control
• Baby monitor
• IP camera
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2.3Module interfaces
2. Module interfaces
2.1. Dimensions and footprint
The HEWBRQU2 dimensions are 57.96±0.35 mm (W) × 21.70±0.35 mm (L) ×
4.6±0.15 mm (H). The gure below shows the dimensions of the HEWBRQU2
module.
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3.2Electrical parameters
3. Electrical parameters
3.1. Absolute electrical parameters
Parameters Description
Minimum
value
Maximum
value
Unit
Ts
Storage
temperature
−40 105 °C
VDD
Supply
voltage
−0.3 18 V
Electrostatic
discharge
voltage
(human body
model)
TAMB −25°C - 2 kV
Electrostatic
discharge
voltage
(machine
model)
TAMB −25°C - 0.5 kV
3.2. Operating conditions
Parameters Description
Minimum
value
Typical
value
Maximum
value
Unit
Ta
Operating
temperature
−20 - 85 °C
VDD
Operating
voltage
4.5 5 18 V
VIL
I/O low-
level input
- - 0.8 V
VIH
I/O high-
level input
2.0 - - V
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4.3RF parameters
Parameters Description
Minimum
value
Typical
value
Maximum
value
Unit
VOL
I/O low-
level
output
- - 0.4 V
VOH
I/O high-
level
output
2.4 - - V
Imax
I/O drive
current
- - 16 mA
Cpad
Input pin
capacitor
- 2 - pF
3.3. Radio frequency (RF) power
• Power consumption during continuous transmission (TX)
Symbol Mode Power
Average
value
Peak
(Typical)
value
Unit
IRF
802.11b, 1
Mbit/s
17 dBm 171 246 mA
IRF
802.11b,
11 Mbit/s
17 dBm 162 240 mA
IRF
802.11g, 6
Mbit/s
17 dBm 156 230 mA
IRF
802.11g,
54 Mbit/s
15 dBm 130 226 mA
IRF
802.11n,
BW20
MCS0
17 dBm 152 234 mA
IRF
802.11n,
BW20
MCS7
14 dBm 124 218 mA
• Power consumption during continuous reception (RX)
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4.4RF parameters
Symbol Mode
Average
value
Peak
(Typical)
value
Unit
IRF
802.11b, 11
Mbit/s
55 71 mA
IRF
802.11g, 54
Mbit/s
50 70 mA
IRF
802.11n,
HT20 MCS7
53 75 mA
3.4. Power consumption in operating mode
Operating
mode
Status (Ta =
25°C)
Average
value
Peak
(Typical)
value
Unit
Pairing over
Bluetooth
The module is
pairing over
Bluetooth.
The network
status
indicator
blinks quickly.
49 280 mA
Pairing over
AP
The module is
in AP mode.
The Wi-Fi
network
status
indicator
blinks slowly.
51 290 mA
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4.5RF parameters
Operating
mode
Status (Ta =
25°C)
Average
value
Peak
(Typical)
value
Unit
Connected
and idle mode
The module is
connected to
the cloud. The
network
status
indicator is
steady on.
23 85 mA
Connected
and operating
mode
The module is
connected to
the cloud. The
network
status
indicator is
steady on.
45 276 mA
Weakly
connected
The
connection
between the
module and
the access
point is
intermittent.
The network
status
indicator is
steady on.
49 265 mA
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4.5RF parameters
Operating
mode
Status (Ta =
25°C)
Average
value
Peak
(Typical)
value
Unit
Disconnected
The module is
disconnected
from the
cloud. The
network
status
indicator is
steady o.
40 288 mA
Module
disabled
The module’s
enable (EN)
pin is pulled
down.
13 49 mA
The above reference data is based on the module being powered by a DC
regulated power supply at 5V, utilizing the Tuya-Haier rmware v1.0.3. For
the same rmware, test results might vary slightly due to dierences in the
specic module, control board, and power supply used.
9 / 28
4.5RF parameters
4. RF parameters
4.1. Basic RF features
Parameter Description
Frequency range 2.400 to 2.4835 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth standard Bluetooth LE 4.2
Data transmission rate
• IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/
s
• IEEE 802.11g: 6, 9, 12, 18, 24, 36,
48, and 54 Mbit/s
• IEEE 802.11n: HT20 MCS0-7
Antenna type
PCB antenna with a peak gain of 0.77
dBi
4.2. Transmitter (TX) performance
• Continuous TX performance:
Parameter
Minimum
value
Typical value
Maximum
value
Unit
RF average
output power,
802.11b CCK
mode, 1 Mbit/
s
- 17 - dBm
RF average
output power,
802.11g
OFDM mode,
54 Mbit/s
- 14 - dBm
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5.3Antenna information
Parameter
Minimum
value
Typical value
Maximum
value
Unit
RF average
output power,
802.11n
OFDM mode,
MCS7
- 13 - dBm
RF average
output power,
Bluetooth LE
4.2, 1 Mbit/s
- 5 - dBm
Frequency
error
−20 - 20 ppm
CCK 11 Mbit/s
mode, 17
dBm
- - −10 dB
OFDM 54
Mbit/s mode,
14 dBm
- - −29 dB
OFDM MCS7
mode, 13
dBm
- - −30 dB
• Receiver (RX) performance:
Parameter
Minimum
value
Typical value
Maximum
value
Unit
PER < 8%, RX
sensitivity,
802.11b CCK
mode, 1 Mbit/
s
- −96 - dBm
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5.3Antenna information
Parameter
Minimum
value
Typical value
Maximum
value
Unit
PER < 10%,
RX sensitivity,
802.11g
OFDM mode,
54 Mbit/s
- −75 - dBm
PER < 10%,
RX sensitivity,
802.11n
OFDM mode,
MCS7
- −72 - dBm
PER < 10%,
RX sensitivity,
Bluetooth LE
4.2, 1 Mbit/s
- −93 - dBm
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5.3Antenna information
5. Antenna information
5.1. Antenna type
This module has an onboard PCB antenna with a peak gain of 0.77 dBi.
5.2. Antenna interference reduction
When a PCB antenna is used on a Wi-Fi module, we recommend that the module
antenna is at least 15 mm away from other metal components. This can optimize
the Wi-Fi performance.
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6.3Power-on and power-o sequence
6. Power-on and power-o sequence
6.1. Power-on sequence
The W701 chip has requirements for the power-on sequence. It is recommended
that the time for the voltage to rise from 0V to 3.3V should be within 20 ms.
6.2. Power-o sequence
Symbol Parameters
Minimum
value
Typical
value
Maximum
value
Unit
TPRDY
3.3V ready
time
0.6 - 20 ms
14 / 28
7.3Footprint and production
instructions
Symbol Parameters
Minimum
value
Typical
value
Maximum
value
Unit
CHIP_EN
CHIP_EN
ready time
0.6 - 20 ms
VBOR
Brown-out
reset (BOR)
occurs after
3.3 V is
lower than
this voltage
2 - - V
TRST
The
required
time that
3.3 V is
lower than
VBOR
1 - - ms
15 / 28
7.3Footprint and production
instructions
7. Footprint and production instructions
7.1. Mechanical dimensions
The HEWBRQU2 module’s PCB dimensions are 42.70±0.35 mm (W) ×
21.70±0.35 mm (L) × 1.0±0.15 mm (H). The gure below shows the dimensions
of the HEWBRQU2 module.
16 / 28
8.2MOQ and packaging information
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8.2MOQ and packaging information
The default tolerance of the dimensions is ±0.35 mm. If you have special
requirements for key dimensions, specify them in the datasheet after
consultations.
7.2. Production instructions
• Package the module with the SMT if Tuya’s module is designed to be SMT-
packaged. After being unpacked, the module must be soldered within 24 hours.
Otherwise, it needs to be put into a drying cupboard with a relative humidity
level no greater than 10%, or packaged in vacuum again. Then, record the
18 / 28
8.3MOQ and packaging information
packing time and duration of exposure. The total exposure time cannot exceed
168 hours.
• Instruments or devices required for the SMT process:
• Surface mount system
• SPI
• Reow soldering machine
• Thermal proler
• Automated optical inspection (AOI) equipment
• Instruments or devices required for the baking process:
• Cabinet oven
• Electrostatic discharge (ESD) protection and heat-resistant trays
• ESD protection and heat-resistant gloves
• A delivered module must meet the following storage requirements:
• The moisture-proof bag must be placed in an environment where the
temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when the
product is packaged and sealed.
• A humidity indication card (HIC) is put in the sealed package.
• The module needs to be baked in the following cases:
• The vacuum packaging bag is damaged before unpacking.
• After unpacking, no HIC is found in the packaging bag.
• After unpacking, the HIC indicates a humidity level of 10% or higher. In this
case, the circle turns pink on the HIC.
• The total exposure time has lasted for over 168 hours since unpacking.
• More than 12 months have passed since the rst sealing of the bag.
• The baking parameter settings are described below:
19 / 28
8.3MOQ and packaging information
• Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And
125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant
tray, rather than a plastic container).
• Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
• Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray
packaging.
• Production can begin after a module has cooled down to below 36°C under
natural conditions.
• If a module remains unused for over 168 hours after being baked, it needs to
be baked again.
• If a batch of modules is not baked after exposure for more than 168 hours, do
not use wave soldering to solder them. Because these modules are level-3
moisture-sensitive devices, they are very likely to get damp when exposed
beyond the allowable time. In this case, if they are soldered at high
temperatures, device failure or poor soldering performance might occur.
• In the whole production process, take electrostatic discharge (ESD) protective
measures.
• To guarantee the pass rate, we recommend that you use the SPI and AOI to
monitor the quality of solder paste printing and mounting.
7.3. Recommended oven temperature curve
Set the temperature according to the following temperature curve of reow
soldering. The peak temperature is 245°C.
20 / 28
8.4MOQ and packaging information
• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period from
60s to 120s
• F: keep a temperature above liquidus temperature for 50s to 70s
• G: peak temperature from 235°C to 245°C
•
H: ramp-down slope from 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information
about other solder pastes, see the recommended oven temperature curve
in the specied solder paste specications.
21 / 28
8.4MOQ and packaging information
7.4. Storage conditions
22 / 28
8.5MOQ and packaging information
8. MOQ and packaging information
Model MOQ (pcs)
Shipping
packaging
Modules per
reel
Reels per
carton
HEWBRQU2 3,600 Tape and reel 900 4
23 / 28
9Appendix: Statement
9. Appendix: Statement
FCC Caution: Any changes or modications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
List of applicable FCC rules This module has been granted modular approval
as below listed FCC rule parts. FCC Rule parts 15C (15.247)
List of applicable ISED rules This module has been certicated modular
approval as below listed ISED Radio Standards Specications. RSS 247 Issue 4
This device generates, uses, and can radiate radio frequency energy and, if not
installed and used following the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this device does cause harmful interference to
radio or television reception, which can be determined by turning the device o
and on, the user is encouraged to try to correct the interference by one or more
of the following measures: • Reorient or relocate the receiving antenna. •
Increase the separation between the device and receiver. • Connect the device to
an outlet on a circuit dierent from that to which the receiver is connected. •
Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an
uncontrolled rolled environment. This device should be installed and operated
with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously
with other radios in the host system except following FCC multi-transmitter
product procedures. Additional testing and device authorization may be required
to operate simultaneously with other radios.
24 / 28
The availability of some specic channels and/or operational frequency bands is
country dependent and is rmware programmed at the factory to match the
intended destination. The rmware setting is not accessible to the end-user.
The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of
certication. The nal host product still requires Part 15 Subpart B compliance
testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as
shown in this manual, including “This product must be installed and operated
with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-HEWBRQU2. The end product must be
labeled in a visible area with the following: “Contains Transmitter Module FCC ID:
2ANDL-HEWBRQU2”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the
antenna and users, and the transmitter module may not be co-located with any
other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be
required. However, the OEM integrator is still responsible for testing their end-
product for any additional compliance requirements required with this module
installed.
This radio transmitter [23243-HEWBRQU2] has been
approved by Innovation, Science and Economic Development Canada to operate
with the antenna types listed below, with the maximum permissible gain
indicated. Antenna types not included in this list that have a gain greater than
the maximum gain indicated for any type listed are strictly prohibited for use with
this device.
Cet émetteur radio [23243-HEWBRQU2] a été
approuvé par Innovation, Sciences et Développement économique Canada pour
fonctionner avec les types d’antennes énumérés ci-dessous, avec le gain
maximal autorisé indiqué. Les types d’antennes non inclus dans cette liste et
dont le gain est supérieur au gain maximal indiqué pour tout type listé sont
strictement interdits pour utilisation avec cet appareil.
25 / 28
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant
provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of
conformity can be found at https://www.tuya.com .
This product must not be disposed of as normal household waste, in accordance
with the EU directive for waste electrical and electronic equipment
(WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point
of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of20cm from the human
body.
Industry Canada Statement This device complies with Industry Canada’s
licence-exempt RSSs. Operation is subject to the following two conditions: (1)
This device may not cause interference. (2) This device must accept any
interference, including interference that may cause undesired operation of the
device. Le présent appareil est conforme aux CNR d’Industrie Canada applicables
aux appareils radio exempts de licence. L’exploitation est autorisée aux deux
conditions suivantes: (1) l’appareil ne doit pas produire de brouillage. (2)
l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique sub i, même
si le brouillage est susceptible d’en compromettre le fonctionnement.
Radiation Exposure Statement This equipment complies with IC radiation
exposure limits set forth for an uncontrolled environment. This equipment should
26 / 28
be installed and operated with a minimum distance of 20 cm between the
radiator & your body.
Déclaration d’exposition aux radiations: Cet équipement est conforme aux
limites d’exposition aux rayonnements ISED établies pour un environnement non
contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm
de distance entre la source de rayonnement et votre corps. L’appareil peut
interrompre automatiquement la transmission en cas d’absence d’informations à
transmettre ou de panne opé rationnelle. Notez que ceci n’est pas destiné à
interdire la transmission d’informations de contrôle ou de signalisation ou
l’utilisation de codes répétitifs lorsque cela est requis par la technologie.
This device is intended only for OEM integrators under the following
conditions: (1) The antenna must be installed such that 20 cm is maintained
between the antenna and users. (2) The transmitter module may not be co-
located with any other transmitter or antenna. As long as 2 conditions above are
met, further transmitter tests will not be required. However, the OEM integrator is
still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les
conditions suivantes: (Pour utilisation de dispositif module) (1) L’antenne
doit être installée de telle sorte qu’une distance de 20 cm est respectée entre
l’antenne et les utilisateurs. (2) Le module émetteur peut ne pas être coïmplanté
avec un autre é metteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplé mentaires sur
l’émetteur neseront pas nécessaires. Toutefois, l’intégrateur OEM est toujours
responsable des essais sur son produit nal pour toutes exigences de conformité
supplémentaires requis pour ce module installé.
IMPORTANT NOTE: In the event that these conditions can not be met (for
example, certain laptop congurations or colocation with another transmitter),
then the Canada authorization is no longer considered valid and the IC ID can not
be used on the nal product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Canada authorization.
27 / 28
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites
(par exemple pour certaines congurations d’ordinateur portable ou de certaines
co-localisation avec un autre émetteur), l’autorisation du Canada n’est plus
considéré comme valide et l’ID IC ne peut pas être utilisé sur le produit nal.
Dans ces circonstances, l’intégrateur OEM sera chargé de réévaluer le produit
nal (y compris l’émetteur) et l’obtention d’une autorisation distincte au Canada.
End Product Labeling This transmitter module is authorized only for use in a
device where the antenna may be installed such that 20 cm may be maintained
between the antenna and users. The nal end product must be labeled in a
visible area with the following: “Contains IC:23243-HEWBRQU2”.
Plaque signalétique du produit nal Ce module émetteur est autorisé
uniquement pour une utilisation dans un dispositif où l’antenne peut être
installée de telle sorte qu’une distance de 20cm peut être maintenue entre
l’antenne et les utilisateurs. Le produit nal doit être étiqueté dans un endroit
visible avec l’inscription suivante: “Contient des IC:23243-HEWBRQU2”.
Manual Information To the End User The OEM integrator has to be aware not
to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product that integrates this module. The
end user manual shall include all required regulatory information/warning as
shown in this manual.
Manuel d’information à l’utilisateur nal L’intégrateur OEM doit être
conscient de ne pas fournir des informations à l’utilisateur nal quant à la façon
d’installer ou de supprimer ce module RF dans le manuel de l’utilisateur du
produit nal qui intègre ce module. Le manuel de l’utilisateur nal doit inclure
toutes les informations réglementaires requises et avertissements comme
indiqué dans ce manuel.
28 / 28
