Circuit Specialists CSI825A Microprocessor Controlled Hot Air Rework Station with Vacuum Pickup

CSI825A Hot Air Owner's Manual - Page 4

For CSI825A.

PDF File Manual, 5 pages, Read Online | Download pdf file

CSI825A photo
Loading ...
Loading ...
Loading ...
4. Operating Instructions
4-1. Preparing your work before using your rework station.
Select the FP Pick-up wire, The size of the IC should match the size of the Wire. You have two
choices, the 14mm or the 30mm.
Select the proper nozzle size that will match the IC size. Installation of the nozzle should be done
before you turn on the rework station to avoid burning ones self accidently.
4-2. How to remove solder.
Turn on the power switch. Set your Air Flow Speed first. Then set your temperature second. The
heat indicator lamp should be show a rise in the temperature.
Place the FP Pick-up wire under the IC. If the pick-up wire is not the right size the metal is
bendable to the right size.
MELTING THE SOLDER
NOTE: Do Not touch the PLN of the IC with the Nozzle of the rework station.
Hold the Hot air handle facing down over the IC. Make sure and point the hot air outlets over the
area you wish to de solder. Wait until you see that the solder is completely melted and lift the FP pick-up
wire thus removing the IC from the board.
Shutting Down your rework station.
Once you have turned off the rework station the unit will go into a cool down mode before com-
pletely turning off. The airflow will increase to full and continue to blow until the unit is safe to shut off.
During this process you should not unplug the unit as it could cause the unit to over heat. Damage that may
occur.
would be melting of the handle or damage to the controller board.
When the temperature of the unit reaches below 100DegC The machine will automatically power
down, If the unit is not going to be used for some time it is suggested that the unit be unplugged from the
wall outlet as the unit still uses some electricity even in the power off state.
Clean the Remaining Solder
After the IC is removed from the board the remaining solder if any should be removed. Some
solutions are to use a Solder Absorber, Solder sucker or solder braid.
Re soldering
Lay some solder paste on the area of the solder pads. Place the SMD in place on the board. Evenly
apply hot air to the SMD pins and wait until the solder paste has melted evenly. Once the IC is soldered in
place check to make sure that there are no solder balls or solder links between pins.
PRECAUTIONS:
* Do not over tighten nozzle when installing it.
* Be careful when working with high temperatures, DON'T USE THIS PRODUCT NEAR FLAM-
MABLE GAS, PAPER, OR OTHER FLAMMABLE OBJECTS. The temperature of the nozzle and hot
air are hot enough to burn a person SEVERELY. DO NOT touch or blow hot air on any part of your body
or anyone else.
* The first time the unit is started you may see and smell a small amount of smoke from the unit. Since it is
new the materials have not yet undergone any heat stresses, the unit should be taken outside and turned on.
This is normal the first time it is used.
Loading ...